HP 6005 manual Ide

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QuickSpecs

HP Compaq 6005 Pro Business PC

Standard Features and Configurable Components (availability may vary by country)

Microtower and Small Form Factor

Maximum Memory*

Supports up to 16GB of un-buffered non-ECC DDR3 SDRAM.

 

 

 

The DIMM connectors for Channel A slot 3 and Channel B slot 4 are black and these slots

 

must always be populated first in the channel. Not all possible memory configurations are

 

represented in the table below.

 

 

 

 

 

NOTE: For systems configured with more than 3GB of memory and a 32-bit operating

 

system, all memory may not be available to the OS due to system resource requirements.

 

Addressing memory above 4GB requires a 64-bit operating system.

 

 

 

 

 

 

 

 

 

 

Total Memory

 

 

DIMM Slot Population

 

 

 

Channel A

 

Channel B

 

 

 

1 (white)

 

3 (black)

2 (white)

 

4 (black)

1-GB

 

 

 

 

 

1GB

(Single Channel)

 

 

 

 

 

 

 

2-GB

 

 

1GB

 

 

1GB

(Dual Channel)

 

 

 

 

 

 

 

3-GB

 

 

2GB

 

 

1GB

(Dual Channel)

 

 

 

 

 

 

 

4-GB

 

 

2GB

 

 

2GB

(Dual Channel)

 

 

 

 

 

 

 

4-GB

1GB

 

1GB

1GB

 

1GB

(Dual Channel)

 

 

 

 

 

 

 

8-GB

2GB

 

2GB

2GB

 

2GB

(Dual Channel)

 

 

 

 

 

 

 

16-GB maximum

4GB

 

4GB

4GB

 

4GB

(Dual Channel)

 

 

 

 

 

 

 

 

 

 

 

 

Expandability

Microtower

 

Small Form Factor

PCI slots

1 full-height

 

1 low-profile

 

 

Max power per slot

35W

 

35W

 

 

PCIe x1 slot

2

 

2

 

 

Max power per slot

10W

 

10W

 

 

PCIe x16 slot

1 full-height

 

1 low-profile

 

 

Max power per slot

75W

 

35W

 

 

External Bays

 

 

 

 

 

 

 

3.5"

1

 

1

 

 

5.25"

2

 

1

 

 

IDE

 

 

 

 

 

 

 

Internal 3.5" HDD Bays

2

 

1

 

 

Hard Drive Controller

SATA

 

SATA

 

 

(SATA) Supported

 

 

 

 

 

 

 

Hard Drive Interfaces

SATA 3.0Gb/s

 

SATA 3.0Gb/s

 

 

Supported

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DA - 13412 Worldwide QuickSpecs — Version 6 — 10/14/2009

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Contents Microtower OverviewSmall Form Factor At a GlanceQuickSpecs Model Key and Example Configurable Components Select Models localized by RegionsOperating System Preinstalled SupportedCertified Value-added Services FeaturesValue-added Software SFF Processor AMD Sempron Processors with HyperTransport TechnologyMemory Supports un-buffered non-ECC DDR3 Sdram IDE Hard Drive DriveNIC Audio GraphicsInput Devices MiscellaneousAfter-Market Options availability may vary by region Monitors AccessoriesMultimedia Optical Drives DVD-ROM DriveTemperature Range Technical SpecificationsMicrotower Small Form Factor Power Supply Relative HumidityOther Features Description ROM Bios InformationServiceability Features of System Serviceability Features of ChassisAdditional Features Description High Definition Audio Type Technical Specifications AudioCodec Audio Jacks External Speaker Jack Yes Line-OutTechnical Specifications Communications Storage temperature WeightPower consumption Platform/WLAN Mode Output power approximatelyData transfer rate Data Rate MCS Minimum Throughput AntennaCertifications EMC Technical Specifications Graphics Board configuration Specification Description Display max resolutionATI Radeon HD MB DH PCIe Graphics Card Bus type Maximum vertical refreshRamdac APIs HP DisplayPort to DVI Connectors Display ResolutionAdapter weight SupportQuickSpecs Technical Specifications Internal Storage Cache 10,000 RPM Serial ATA 160-GB Hard Drives 80-GB CapacityHost transfer rate Ultra DMA mode Dimensions-externalPower DC power requirement Total powerTechnical Specifications Input/Output Devices ESDEMI RFI PS/2 Standard Physical Keys Dimensions H x W x DMechanical Languages HP USB Smartcard Physical KeysSmartcard function Support Supported PowerStandard APIs Communication From cardUSA MtbfEMI-RFI ESD EMI-RFI HP PS/2 Optical Scroll MouseTechnical Specifications Optical Storage DVD-R DL DVD+R DLDVD+RW, DVD-RW DVD+R DL, DVD-R DL DVD-ROM DLDVD-ROM CD-R Technical Specifications Removable Storage Connectivity Design Guide V Technical Specifications Environmental Data Internal Packaging Materials ExternalMaterial Usage RoHS ComplianceEnd-of-life PackagingManagement Recycling Hewlett-Packard