Telit Wireless Solutions 1vv0300773a Mounting the GE863-PRO3on the Application Board, 11.1General

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GE863-PRO3Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

11Mounting the GE863-PRO3on the Application Board

11.1General

The Telit GE863-PRO3module has been designed in order to be compliant with a standard lead-free SMT process

11.1.1Stencil

Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a thickness of stencil foil ≥ 120µm.

11.1.2PCB pad Design

“Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.

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Contents GE863-PRO3Hardware User Guide Contents GE863-PRO 3 Hardware User Guide This document is relating to the following products Disclaimer Overview Telit GE863-PRO3module overall dimension are GE863-PRO3Mechanical DimensionsLength 41,4 mm Width 31,4 mm Thickness 3,6 mm GE863-PRO3module connections D10 GND D11 Simvcc D12 Simclk E1 GND E2 Pwrmon DTE GPIO7 / Rftxdisable GSMC2 Vbatt C3 Vrtc C11 Simrst C12 Simio D1 Charge D2 VAUX1ON/OFF*-AP Nrst Reset ARMPB8 PB9PB7 PB0PB2 PB1PA3 HdmbXIN32 XOUT32Reserved GND VBATT2Balls Layout ARM PIO Controller a multiplexing ARM Port IO multiplexingARM PIO Controller B multiplexing ARM PIO Controller C multiplexing Turning on the GE863-PRO3GSM/GPRS Engine Hardware Commands+1,8/5 10k2Turning OFF the GE863-PRO3GSM/GPRS Engine Hardware Unconditional Reboot of GSM/GPRS EngineHardware shutdown Turning ON/OFF the GE863-PRO3ARM ON/OFF*-AP # GND AT+CFUN=4 Power SupplyGSM Power Supply Requirements AT+CFUN=1Vrtc Backup supply ARM Power Supply Requirements817A19A Seiko General Design RulesElectrical design Guidelines Suggested circuit is1.1 + 5V input Source Power Supply Design Guidelines 1.2 + 12V input Source Power Supply Design Guidelines Battery Source Power Supply Design Guidelines Battery Charge control Circuitry Design Guidelines GE863-PRO3Hardware User Guide Thermal Design Guidelines Power Supply PCB layout Guidelines GSM Antenna Requirements Antenna50 ohm GSM Antenna PCB line GuidelinesElectro Magnetic Interference Guidelines GSM Antenna installation GuidelinesAbsolute Maximum Ratings -Not Functional Parameter Min Max Logic level specificationsOperating Range Interface levels Cmos Level Min Max Operating Range Interface levels Cmos Vrtc Level Min Max GSM Gpio Current characteristics Level TypicalCmos 3.1V Current characteristics Level Typical Cmos 1.8V-A Current characteristics Level TypicalPhone reset Signal FunctionSignal Min Max Modem Serial Port Modem Serial Port 2 Debug Serial PortsSignals of the GE863-PRO3GSM/GPRS engine serial port are RS232 level translation An example of level translation circuitry of this kind is GE863-PRO3Hardware User Guide Audio Section Overview Short description Input Lines MicrophoneMicmt 1st differential microphone path Input Lines CharacteristicsOutput Lines Speaker Earmt Differential Line-out Drivers Path Output Lines CharacteristicsEvaluation Kit for Telit GE863- PRO3 Modules ON/OFF 10 GSM/GPRS General Purpose I/O10.4Using the Rftxmon Output GPIO3 Using a Gpio Pad as InputUsing a Gpio Pad as Output Using the RF Transmission Control GPIO7Using the Buzzer Output GPIO4 Using the Alarm OutputLED status 10.7Indication of network service availabilityDevice Status Operating Range VAUX1 power supply 10.9VAUX1 power outputRTC Bypass out PCB pad Design Mounting the GE863-PRO3on the Application Board11.1General StencilSolder paste Following is the recommended solder reflow profile 11.1.4 GE863-PRO3Solder Reflow3C/second max Section A-A Packing SystemModules orientation on tray Moisture Sensibility Conformity Assessment Issues Safety Recommandations Revision Date Changes Document Change Log

1vv0300773a specifications

Telit Wireless Solutions 1VV0300773A is an advanced cellular module specifically designed for a wide range of IoT applications. This module is part of Telit’s extensive portfolio, which is renowned for its reliability and innovation in the wireless communication space. The 1VV0300773A module stands out due to its compact design and robust performance, making it an ideal choice for developers looking to integrate cellular connectivity into their projects.

One of the main features of the 1VV0300773A is its support for multiple communication protocols, which enhances its versatility. The module is designed to support various LTE CAT M1 and NB-IoT networks. These technologies are critical for low-power wide-area network (LPWAN) applications, allowing devices to stay connected over long distances while consuming minimal energy. This is particularly beneficial for battery-operated devices in sectors like smart agriculture, smart cities, and industrial IoT.

The module is equipped with a powerful ARM Cortex-M3 processor, which enables efficient data processing and facilitates complex computations required for many IoT applications. Additionally, it features a comprehensive set of interfaces, including UART, GPIO, and I2C, enabling easy integration with various sensors and peripherals. This modularity ensures that developers can customize their applications based on specific business needs.

Security is another crucial aspect of the 1VV0300773A module. Telit incorporates advanced security features including secure boot, data encryption, and a secure element, ensuring that data transmitted over cellular networks is protected against unauthorized access. This commitment to security is vital in today’s increasingly connected world, where data privacy is a top concern.

Furthermore, the 1VV0300773A module supports extensive over-the-air firmware updates, allowing manufacturers to deploy updates and enhancements seamlessly. This capability extends the lifecycle of devices in the field and ensures that they can adapt to new requirements and security standards over time.

In summary, Telit Wireless Solutions 1VV0300773A offers a blend of advanced features, robust technologies, and essential characteristics tailored for the rapidly evolving IoT landscape. Its combination of multi-network support, secure communication, and efficient processing makes it a standout choice for developers and enterprises looking to enhance their connectivity solutions.
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