Telit Wireless Solutions 1vv0300773a manual Solder paste

Page 56

GE863-PRO3Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

Recommendations for PCB pad dimensions

	Ball pitch [mm]		2
	Solder resist opening diameter A [mm]		1,150
	Metal pad diameter B [mm]		1 ± 0.05

Placement of microvias not covered by solder resist is not recommended inside the “Solder resist opening”, unless the microvia carry the same signal of the pad itself.

Holes in pad are allowed only for blind holes and not for through holes.

Recommendations for PCB pad surfaces:

Finish	Layer thickness [µm]
Electro-less Ni /	3 –7 /
Immersion Au	0.05 – 0.15

Properties

good solder ability protection, high shear force values

The PCB must be able to resist the higher temperatures, which are occurring at the lead-free process. This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-lead solder paste on the described surface plating is better compared to lead-free solder paste.

11.1.3Solder paste

	Lead free

Solder paste	Sn/Ag/Cu

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved

page 56 of 64

Image 56

Contents GE863-PRO3Hardware User Guide Contents GE863-PRO 3 Hardware User Guide This document is relating to the following products Disclaimer Overview Length 41,4 mm Width 31,4 mm Thickness 3,6 mm GE863-PRO3Mechanical DimensionsTelit GE863-PRO3module overall dimension are GE863-PRO3module connections DTE GPIO7 / Rftxdisable GSM C2 Vbatt C3 VrtcC11 Simrst C12 Simio D1 Charge D2 VAUX1 D10 GND D11 Simvcc D12 Simclk E1 GND E2 PwrmonNrst Reset ARM PB8PB9 ON/OFF*-APPB0 PB2PB1 PB7Hdmb XIN32XOUT32 PA3VBATT2 Reserved GNDBalls Layout ARM Port IO multiplexing ARM PIO Controller a multiplexingARM PIO Controller B multiplexing ARM PIO Controller C multiplexing Hardware Commands Turning on the GE863-PRO3GSM/GPRS Engine10k +1,8/5Hardware shutdown Hardware Unconditional Reboot of GSM/GPRS Engine2Turning OFF the GE863-PRO3GSM/GPRS Engine Turning ON/OFF the GE863-PRO3ARM ON/OFF*-AP # GND Power Supply GSM Power Supply RequirementsAT+CFUN=1 AT+CFUN=4ARM Power Supply Requirements Vrtc Backup supplyGeneral Design Rules Electrical design GuidelinesSuggested circuit is 817A19A Seiko1.1 + 5V input Source Power Supply Design Guidelines 1.2 + 12V input Source Power Supply Design Guidelines Battery Source Power Supply Design Guidelines Battery Charge control Circuitry Design Guidelines GE863-PRO3Hardware User Guide Thermal Design Guidelines Power Supply PCB layout Guidelines Antenna GSM Antenna RequirementsGSM Antenna PCB line Guidelines 50 ohmGSM Antenna installation Guidelines Electro Magnetic Interference GuidelinesOperating Range Interface levels Cmos Level Min Max Logic level specificationsAbsolute Maximum Ratings -Not Functional Parameter Min Max GSM Gpio Current characteristics Level Typical Cmos 3.1V Current characteristics Level TypicalCmos 1.8V-A Current characteristics Level Typical Operating Range Interface levels Cmos Vrtc Level Min MaxSignal Min Max Signal FunctionPhone reset Serial Ports Modem Serial Port Modem Serial Port 2 DebugSignals of the GE863-PRO3GSM/GPRS engine serial port are RS232 level translation An example of level translation circuitry of this kind is GE863-PRO3Hardware User Guide Audio Section Overview Input Lines Microphone Short descriptionInput Lines Characteristics Micmt 1st differential microphone pathOutput Lines Speaker Output Lines Characteristics Earmt Differential Line-out Drivers PathEvaluation Kit for Telit GE863- PRO3 Modules 10 GSM/GPRS General Purpose I/O ON/OFFUsing a Gpio Pad as Input Using a Gpio Pad as OutputUsing the RF Transmission Control GPIO7 10.4Using the Rftxmon Output GPIO3Using the Alarm Output Using the Buzzer Output GPIO4 Device Status 10.7Indication of network service availability LED status RTC Bypass out 10.9VAUX1 power outputOperating Range VAUX1 power supply Mounting the GE863-PRO3on the Application Board 11.1GeneralStencil PCB pad DesignSolder paste 11.1.4 GE863-PRO3Solder Reflow Following is the recommended solder reflow profile3C/second max Packing System Section A-AModules orientation on tray Moisture Sensibility Conformity Assessment Issues Safety Recommandations Document Change Log Revision Date Changes