Telit Wireless Solutions 1vv0300773a manual 3C/second max

Page 58

GE863-PRO3Hardware User Guide

1vv0300773a Rev. 0 - 24/01/08

 

Profile Feature

 

 

Pb-Free Assembly

 

 

 

 

 

 

 

 

 

 

 

 

Average ramp-up rate (TL to TP)

 

 

3°C/second max

 

 

 

 

 

 

 

 

 

 

 

 

Preheat:

 

 

150°C

 

 

 

 

 

 

– Temperature Min (Tsmin)

 

 

 

 

– Temperature Max (Tsmax)

 

 

200°C

 

 

– Time (min to max) (ts)

 

 

60-180 seconds

 

 

 

 

 

 

 

 

Tsmax to TL:

 

 

3°C/second max

 

 

 

 

 

 

– Ramp-up Rate

 

 

 

 

 

 

 

 

 

 

Time maintained above:

 

 

217°C

 

 

 

 

 

 

– Temperature (TL)

 

 

 

 

– Time (tL)

 

 

60-150 seconds

 

 

 

 

 

 

 

 

Peak Temperature (Tp):

 

 

245 +0/-5°C

 

 

 

 

 

 

 

 

 

 

 

 

Time within 5°C of actual Peak

 

 

10-30 seconds

 

 

 

 

 

 

Temperature (tp)

 

 

 

 

 

 

 

 

 

 

 

Ramp-down Rate

 

 

6°C/second max.

 

 

 

 

 

 

 

 

 

 

 

 

Time 25°C to Peak Temperature

 

 

8 minutes max.

 

 

 

 

 

 

 

 

 

 

 

NOTE: All temperatures refer to topside of the package, measured on the package body surface.

NOTE: GE863-PRO3module can accept only one reflow process

Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved

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Contents GE863-PRO3Hardware User Guide Contents GE863-PRO 3 Hardware User Guide This document is relating to the following products Disclaimer Overview Telit GE863-PRO3module overall dimension are GE863-PRO3Mechanical DimensionsLength 41,4 mm Width 31,4 mm Thickness 3,6 mm GE863-PRO3module connections C11 Simrst C12 Simio D1 Charge D2 VAUX1 DTE GPIO7 / Rftxdisable GSMC2 Vbatt C3 Vrtc D10 GND D11 Simvcc D12 Simclk E1 GND E2 PwrmonPB9 Nrst Reset ARMPB8 ON/OFF*-APPB1 PB0PB2 PB7XOUT32 HdmbXIN32 PA3VBATT2 Reserved GNDBalls Layout ARM Port IO multiplexing ARM PIO Controller a multiplexingARM PIO Controller B multiplexing ARM PIO Controller C multiplexing Hardware Commands Turning on the GE863-PRO3GSM/GPRS Engine10k +1,8/52Turning OFF the GE863-PRO3GSM/GPRS Engine Hardware Unconditional Reboot of GSM/GPRS EngineHardware shutdown Turning ON/OFF the GE863-PRO3ARM ON/OFF*-AP # GND AT+CFUN=1 Power SupplyGSM Power Supply Requirements AT+CFUN=4ARM Power Supply Requirements Vrtc Backup supplySuggested circuit is General Design RulesElectrical design Guidelines 817A19A Seiko1.1 + 5V input Source Power Supply Design Guidelines 1.2 + 12V input Source Power Supply Design Guidelines Battery Source Power Supply Design Guidelines Battery Charge control Circuitry Design Guidelines GE863-PRO3Hardware User Guide Thermal Design Guidelines Power Supply PCB layout Guidelines Antenna GSM Antenna RequirementsGSM Antenna PCB line Guidelines 50 ohmGSM Antenna installation Guidelines Electro Magnetic Interference GuidelinesAbsolute Maximum Ratings -Not Functional Parameter Min Max Logic level specificationsOperating Range Interface levels Cmos Level Min Max Cmos 1.8V-A Current characteristics Level Typical GSM Gpio Current characteristics Level TypicalCmos 3.1V Current characteristics Level Typical Operating Range Interface levels Cmos Vrtc Level Min MaxPhone reset Signal FunctionSignal Min Max Serial Ports Modem Serial Port Modem Serial Port 2 DebugSignals of the GE863-PRO3GSM/GPRS engine serial port are RS232 level translation An example of level translation circuitry of this kind is GE863-PRO3Hardware User Guide Audio Section Overview Input Lines Microphone Short descriptionInput Lines Characteristics Micmt 1st differential microphone pathOutput Lines Speaker Output Lines Characteristics Earmt Differential Line-out Drivers PathEvaluation Kit for Telit GE863- PRO3 Modules 10 GSM/GPRS General Purpose I/O ON/OFFUsing the RF Transmission Control GPIO7 Using a Gpio Pad as InputUsing a Gpio Pad as Output 10.4Using the Rftxmon Output GPIO3Using the Alarm Output Using the Buzzer Output GPIO4LED status 10.7Indication of network service availabilityDevice Status Operating Range VAUX1 power supply 10.9VAUX1 power outputRTC Bypass out Stencil Mounting the GE863-PRO3on the Application Board 11.1General PCB pad DesignSolder paste 11.1.4 GE863-PRO3Solder Reflow Following is the recommended solder reflow profile3C/second max Packing System Section A-AModules orientation on tray Moisture Sensibility Conformity Assessment Issues Safety Recommandations Document Change Log Revision Date Changes
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