
Hardware Specifications and Configurations
Processor
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CPU type |
| AMD S1g2 Processor (Griffin | |||||||
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| (Bandwidth:9.6GB/s to 20.8GB/s) |
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CPU Features |
| • Hyper Transport 3.0 Technology.Designed to support HT Gen 3 speed form | |||||||
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| 1.2Ghz to 2.6Ghz |
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| • Split Power Planes, Separate power planes providesd for each CPU core and | ||||||
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| on die Northbridge |
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| • Up to 2 processor core per die, Upto 1MB L2 cache per die | ||||||
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| • Each CPU core supports up to 8 | ||||||
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| P7 (Lowest) |
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Power |
| • VDD0,VDD1 set according to the respective | |||||||
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| are isolated and VDD set according to the CPU core in the highest | |||||
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| performance |
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| • CPU_VDDNB. VLDT 1.2V_HT, VDD I/O 1.8VSUS. CPU Memory Interface | ||||||
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| SMDDR_VTEM |
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CPU package |
| AMD |
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CPU Fan True Value Table |
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| Level |
| Fan On Temp. |
| Fan Off Temp. | RPM Throttling | dB(A) |
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| 1 |
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| 50 |
| 45 | 2300 | 31 |
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| 2 |
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| 60 |
| 55 | 2600 | 34 |
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| 3 |
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| 70 |
| 65 | 2800 | 37 |
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| 4 |
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| 80 |
| 75 | 3100 | 40 |
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•Throttling 50%: On =100°C ; Off=90°C
•OS Shut down: 125C
•H/W Shut down: 125C
•Fan default: 5V
Northbridge
Item |
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Chipset | AMD RS780MN | |
Features | • | CPU Hyper Transport Interface , Support 16 bit up/down Hyper transport |
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| 3.0 interface up to 5.2GT/s |
| • | PCI Express Interface , Support PCIE GEN2 , Optimizes peer to peer and |
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| general purpose link performance, Highly flexible PCI Express |
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| implementation to suit a variety of platform needs |
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Power | 1.1V,1.2V, 1.8V, 3.3V | |
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Package | FCBGA | |
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18 | Chapter 1 |