Acer 6530 manual Hardware Specifications and Configurations, Processor Specification, Smddrvtem

Hardware Specifications and Configurations

Processor

Item				Specification
CPU type		AMD S1g2 Processor (Griffin Series-Turion/Sempron), T3(1.2~2.6G/s)
		(Bandwidth:9.6GB/s to 20.8GB/s)
CPU Features		• Hyper Transport 3.0 Technology.Designed to support HT Gen 3 speed form
			1.2Ghz to 2.6Ghz
		• 64-bit or 128-bit DDR2 Memory Interface, Two independent 64 Bit DDR2
			channels
		• Split Power Planes, Separate power planes providesd for each CPU core and
			on die Northbridge
		• Up to 2 processor core per die, Upto 1MB L2 cache per die
		• Each CPU core supports up to 8 P-states: P0 (Highest performance) and
			P7 (Lowest)
Power		• VDD0,VDD1 set according to the respective P-stage control when core VDD
			are isolated and VDD set according to the CPU core in the highest
			performance P-state when VDD is common
		• CPU_VDDNB. VLDT 1.2V_HT, VDD I/O 1.8VSUS. CPU Memory Interface
			SMDDR_VTEM
CPU package		AMD 638-pin micro PGA
CPU Fan True Value Table
	Level		Fan On Temp.	Fan Off Temp.	RPM Throttling	dB(A)
	1		50	45	2300	31
	2		60	55	2600	34
	3		70	65	2800	37
	4		80	75	3100	40

•Throttling 50%: On =100°C ; Off=90°C

•OS Shut down: 125C

•H/W Shut down: 125C

•Fan default: 5V

Northbridge

Item		Specification
Chipset	AMD RS780MN
Features	•	CPU Hyper Transport Interface , Support 16 bit up/down Hyper transport
		3.0 interface up to 5.2GT/s
	•	PCI Express Interface , Support PCIE GEN2 , Optimizes peer to peer and
		general purpose link performance, Highly flexible PCI Express
		implementation to suit a variety of platform needs
Power	1.1V,1.2V, 1.8V, 3.3V
Package	FCBGA 528-pin

18 Chapter 1