Microsoft® Windows® 7 Environment Test
Category | Vendor | Description | PN |
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CPU |
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Arrandale | Intel | IC CP80617004122AG SLBMD C2 2.13G | KC.33001.DMP |
2.13G |
| PGA988 |
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(Ci3330M) |
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Arrandale | Intel | IC CP80617004161AC SLBPK C2 2.26G | KC.35001.DMP |
2.26G |
| PGA988 |
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(Ci3350M) |
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Arrandale | Intel | IC CP80617004161AD SLBPN C2 2.26G | KC.43001.DMP |
2.26G |
| PGA988 |
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(Ci5430M) |
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Arrandale | Intel | IC CP80617004119AE SLBNB C2 2.4G | KC.52001.DMP |
2.4G |
| PGA988P |
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(Ci5520M) |
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Arrandale | Intel | IC CP80617004116AD SLBPG C2 2.53G | KC.54001.DMP |
2.53G |
| PGA988 |
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(Ci5540M) |
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Arrandale | Intel | IC CP80617003981AH SLBPD C2 2.66G PGA | KC.62001.DMP |
2.66G |
| 988P |
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(Ci7620M) |
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Q3GG C2 | Intel | CPU Intel Core i3 330M PGA 2.13G 35W | KC.33001.DMP |
2.13G |
| Arrandale, TJ90, VT, 3M L3 |
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Q3LN C2 | Intel | CPU Intel Core i3 350M PGA 2.26G 35W | KC.35001.DMP |
2.26G |
| Arrandale, TJ90, VT, 3M L3 |
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Q3LR C2 | Intel | CPU Intel Core i5 430M PGA 2.26G ARD, uP to | KC.43001.DMP |
2.26G |
| SC 2.53G, 3M L3 |
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RAM SODIMM |
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1G DDR3- | SAMSUNG | DDR3 MODU SAM | KN.1GB0B.028 |
1066 |
| 1066 |
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1G DDR3- | ELDIPA | DDR3 MODU SAM | KN.1GB09.012 |
1066 |
| 1066 |
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1G DDR3- | HYNIX | DDR3 MODU HYN | KN.1GB0G.025 |
1066 |
| 1G/1066 |
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RAM SODIMM |
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2G DDR3- | MICRON | KN.2GB04.015 | |
1066 |
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2G DDR3- | SAMSUNG | DDR3 MODU SAM | KN.2GB0B.012 |
1066 |
| 1066 |
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2G DDR3- | ELDIPA | DDR3 MODU ELP | KN.2GB09.006 |
1066 |
| 1066 |
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2G DDR3- | HYNIX | DDR3 MODU HYN | KN.2GB0G.014 |
1066 |
| 2G/1066 |
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RAM SODIMM |
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4G DDR3- | SAMSUNG | KN.4GB0B.007 | |
1066 |
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4G DDR3- | ELPIDA | Memory NONE | KN.4GB00.001 |
1066 |
| dummy P/N LF |
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RAM SODIMM
194 | Appendix B |