Analog Devices AD8342 specifications Outline Dimensions, Ordering Guide

AD8342 Preliminary Technical Data

OUTLINE DIMENSIONS

3.00

BSC SQ

PIN 1	TOP
INDICATOR	VIEW

			0.50
			0.40
	0.60 MAX		0.30	PIN 1
				INDICATOR
0.45	13	16	1	*1.65
				1.50 SQ
	12
2.75				1.35
BSC SQ		EXPOSED
		PAD

0.50	9	(BOTTOM VIEW) 4
		8	5
BSC			0.25 MIN

12° MAX		0.80 MAX	1.50 REF
0.90		0.65 TYP
0.85		0.05 MAX
0.80
		0.02 NOM
SEATING	0.30
PLANE		0.20 REF
	0.23
	0.18

*COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2

EXCEPT FOR EXPOSED PAD DIMENSION.

Figure 54. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm x 3 mm Body, Very Thin Quad

(CP-16-3)

Dimensions in millimeters

ORDERING GUIDE

	Temperature		Package		Transport Media,
Models	Package	Package Description	Outline	Branding	Quanity
AD8342ACPZ-REEL71	−40°C to +85°C	16-Lead Lead Frame Chip Scale Package	CP-16-3	Q01	1,500, Reel
		[LFCSP_VQ]
AD8342ACPZ-R21	−40°C to +85°C	16-Lead Lead Frame Chip Scale Package	CP-16-3	Q01	250, Reel
		[LFCSP_VQ]
AD8342ACPZ-WP1	−40°C to +85°C	16-Lead Lead Frame Chip Scale Package	CP-16-3	Q01	50, Waffle Pack
		[LFCSP_VQ]
AD8342-EVAL		Evaluation Board			1

1Z = Pb-free part.

© 2005 Analog Devices, Inc. All rights reserved. Trademarks and regis- tered trademarks are the property of their respective owners.

D05352–0–4/05(0)

Rev. 0 Page 20 of 20