![](/images/new-backgrounds/1107856/10785653x1.webp)
Board Layout
The bottom layer of the EVM contains bulk and decoupling capacitors to be placed close to the power and ground pins on the device.
Figure 3−5. Bottom Layer
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| C9 | C10 |
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| C8 | C7 |
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VCC01 |
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| VCC | |
C5 | C4 | C2 | C1 | C6 | C3 |
GND01 |
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| GND |
Bill of Materials, Board Layout, and PCB Construction |