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PCB Construction
Table 3−2 shows the layer stack up of the EVM with the defined trace widths for the controlled impedance etch runs using microstrip construction.
Table 3−2. EVM Layer Stack Up
Material |
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Layer | Layer | Thickness | Copper |
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Line |
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Type: |
| Spacing | Impedance | Impedance | |||||||
No. | Type | (mils) | Weight | Width |
| Width | |||||
FR 406 |
| (mils) | (Ω) |
| (Ω) | ||||||
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| (mils) |
| (mils) |
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| 1 | Signal | 0.0006 | 0.5 oz (start) | 0.027 |
| 0.230 | 100 | 0.0420 |
| 50 |
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PREPREG |
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| 0.025 |
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| 2 | Plane | 0.0012 | 1 |
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CORE |
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| 0.004 |
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| 3 | Plane | 0.0012 | 1 |
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PREPREG |
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| 0.025 |
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| 4 | Signal | 0.0006 | 0.5 oz (start) | 0.027 |
| 0.230 | 100 | 0.0420 |
| 50 |
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Bill of Materials, Board Layout, and PCB Construction |