Compaq M-LVDS manual 2. EVM Layer Stack Up, Mils

PCB Construction

Table 3−2 shows the layer stack up of the EVM with the defined trace widths for the controlled impedance etch runs using microstrip construction.

Table 3−2. EVM Layer Stack Up

Material						Differential Model			Single-Ended		Model
	Layer	Layer	Thickness	Copper
					Line				Line
Type:							Spacing	Impedance		Impedance
	No.	Type	(mils)	Weight	Width				Width
FR 406							(mils)	(Ω)			(Ω)
					(mils)				(mils)
	1	Signal	0.0006	0.5 oz (start)	0.027		0.230	100	0.0420		50
PREPREG			0.025
	2	Plane	0.0012	1
CORE			0.004
	3	Plane	0.0012	1
PREPREG			0.025
	4	Signal	0.0006	0.5 oz (start)	0.027		0.230	100	0.0420		50

3-8 Bill of Materials, Board Layout, and PCB Construction