Cypress manual Package Diagrams, Lead 450 MIL Molded SOIC S34, CY62128B MoBL, + Feedback

CY62128B

MoBL®

Package Diagrams

32-Lead (450 MIL) Molded SOIC S34

16 1

0.546[13.868]

0.566[14.376]

0.440[11.176]

0.450[11.430]

17	32
	0.793[20.142]
	0.817[20.751]	0.006[0.152]
		0.012[0.304]
0.101[2.565]		0.118[2.997]
0.111[2.819]
		MAX.
		0.004[0.102]
	0.004[0.102]	0.047[1.193]
0.050[1.270]		0.063[1.600]
	MIN.	0.023[0.584]
BSC.
	0.014[0.355]	0.039[0.990]
	0.020[0.508]
	SEATING PLANE	51-85081-*B

32-Lead Thin Small Outline Package Type I (8x20 mm) Z32

	51-85056-*D
Document #: 38-05300 Rev. *C	Page 9 of 11

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