CY62136EV30

MoBL®

Pin Configuration[2, 3]

VFBGA (Top View)

44 TSOP II (Top View)

1

2

3

4

5

6

 

BLE

OE

A0

A1

A2

NC

A

I/O8

BHE

A3

A4

CE

I/O0

B

I/O9

I/O10

A5

A6

I/O1

I/O2

C

VSS

I/O11

NC

A7

I/O3

Vcc

D

VCC

I/O

NC

A16

I/O

Vss

E

 

12

 

 

4

 

 

I/O14

I/O13

A14

A15

I/O5

I/O6

F

I/O

NC

A

A13

WE

I/O

G

15

 

12

 

 

7

 

NC

A8

A9

A10

A11

NC

H

A4 A3 A2 A1

A0

CE I/O0 I/O1 I/O2 I/O3

VCC VSS I/O4 I/O5 I/O6 I/O7

WE

A16

A15

A14

A13

A12

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

44 A5

43 A6

42 A7

41 OE

40 BHE

39 BLE

38 I/O15

37 I/O14

36 I/O13

35 I/O12

34 VSS

33 VCC

32 I/O11

31 I/O10

30 I/O9

29 I/O8

28 NC

27 A8

26 A9

25 A10

24 A11

23 NC

Product Portfolio[4]

 

 

 

 

 

 

 

 

 

 

Power Dissipation

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Speed

 

Operating ICC (mA)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Product

 

VCC Range (V)

 

(ns)

f = 1MHz

f = fmax

 

Standby ISB2 (A)

 

Min.

 

Typ.[4]

 

Max.

 

Typ.[4]

 

Max.

Typ.[4]

 

Max.

 

Typ.[4]

Max.

CY62136EV30LL

2.2

 

3.0

 

3.6

45

2

 

2.5

15

 

20

 

1

7

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes:

2.NC pins are not connected on the die.

3.Pins D3, H1, G2, and H6 in the BGA package are address expansion pins for 4 Mbit, 8 Mbit, 16 Mbit and 32 Mbit, respectively.

4.Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC(typ.), TA = 25°C.

Document #: 38-05569 Rev. *B

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Cypress manual Pin Configuration2, Product Portfolio4, Vfbga Top View Tsop II Top View, Max, CY62136EV30LL