Cypress CY62136EV30 Thermal Resistance, AC Test Loads and Waveforms, Data Retention Characteristics, Data Retention Waveform

CY62136EV30

MoBL®

Document #: 38-05569 Rev. *B Page 4 of 12

Thermal Resistance[8]

Parameter Description Test Conditions VFBGA

Package TSOP II

Package Unit

ΘJA Thermal Resistance

(Junction to Ambient)[8] Still Air, soldered on a 3 × 4.5 inch, two-layer

printed circuit board 75 77 °C/W

ΘJC Thermal Resistance

(Junction to Case)[8] 10 13 °C/W

AC Test Loads and Waveforms

Parameters 2.50V 3.0V Unit

R1 16667 1103 Ω

R2 15385 1554 Ω

RTH 8000 645 Ω

VTH 1.20 1.75 V

Data Retention Characteristics (Over the Operating Range)[8, 9]

Parameter Description Conditions Min. Typ.[4] Max. Unit

VDR VCC for Data Retention 1.0 V

ICCDR Data Retention Current VCC= 1.0V

CE > VCC – 0.2V,

VIN > VCC – 0.2V or VIN < 0.2V

0.8 3 µA

tCDR[8] Chip Deselect to Data

Retention Time 0ns

tR[9] Operation Recovery

Time tRC ns

VCC

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10% 90%

10%

Rise Time = 1 V/ns Fall Time = 1 V/ns

OUTPUT VTH

Equivalent to: THÉVENIN EQUIVALENT

ALL INPUT PULSES

RTH

Data Retention Waveform

Notes:

9. Full device operation requires linear VCC ramp from VDR to VCC(min.) > 100 µs or stable at VCC(min.) > 100 µs.

VCC(min)

tCDR

VDR>1.0 V

DATA RETENTION MODE

VCC

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