Cypress CY62138EV30 Thermal Resistance, AC Test Loads and Waveforms, Data Retention Waveform

CY62138EV30

MoBL®

Thermal Resistance

Parameter	Description	Test Conditions	BGA	Unit
ΘJA	Thermal Resistance	Still Air, soldered on a 3 x 4.5 inch, four-layer	72	°C/W
	(Junction to Ambient)	printed circuit board
ΘJC	Thermal Resistance		8.86	°C/W
	(Junction to Case)

AC Test Loads and Waveforms

R1

VCC

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

	VCC	ALL INPUT PULSES
			90%
	10%	90%		10%
R2
	GND			Fall time: 1 V/ns
	Rise Time: 1 V/ns

Equivalent to: THÉVENIN EQUIVALENT

RTH

OUTPUT VTH

Parameters	2.50V	3.0V	Unit
R1	16667	1103	Ω
R2	15385	1554	Ω
RTH	8000	645	Ω
VTH	1.20	1.75	V

Data Retention Characteristics (Over the Operating Range)

Parameter	Description			Conditions		Min.	Typ.[3]	Max.	Unit
VDR	VCC for Data Retention					1			V
ICCDR	Data Retention Current	VCC = 1V,			> VCC − 0.2V,		0.8	3	∝A
				CE
		VIN > VCC − 0.2V or VIN < 0.2V
tCDR[7]	Chip Deselect to Data Retention Time					0			ns
tR[8]	Operation Recovery Time					tRC			ns
Data Retention Waveform
			DATA RETENTION MODE
VCC						1.5V
	VCC (min.)			VDR > 1.5 V

tCDR	tR
CE

Notes:

7.Tested initially and after any design or process changes that may affect these parameters.

8.Full Device AC operation requires linear VCC ramp from VDR to VCC(min.) > 100 ∝s or stable at VCC(min.) > 100 ∝s.

Document #: 38-05577 Rev. *A Page 4 of 9

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