Cypress CY62138EV30 Thermal Resistance, AC Test Loads and Waveforms, Data Retention Characteristics , Data Retention Waveform

CY62138EV30

MoBL®

Document #: 38-05577 Rev. *A Page 4 of 9

Thermal Resistance

Parameter Description Test Conditions BGA Unit

ΘJA Thermal Resistance

(Junction to Ambient) Still Air, soldered on a 3 x 4.5 inch, four-layer

printed circuit board 72 °C/W

ΘJC Thermal Resistance

(Junction to Case) 8.86 °C/W

AC Test Loads and Waveforms

Parameters 2.50V 3.0V Unit

R1 16667 1103 Ω

R2 15385 1554 Ω

RTH 8000 645 Ω

VTH 1.20 1.75 V

Data Retention Characteristics (Over the Operating Range)

Parameter Description Conditions Min. Typ.[3] Max. Unit

VDR VCC for Data Retention 1 V

ICCDR Data Retention Current VCC = 1V, CE > VCC − 0.2V,

VIN > VCC − 0.2V or VIN < 0.2V 0.8 3 µA

tCDR[7] Chip Deselect to Data Retention Time 0 ns

tR[8] Operation Recovery Time tRC ns

VCC

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10% 90%

10%

OUTPUT VTH

Equivalent to: THÉVENIN EQUIVALENT

ALL INPUT PULSES

RTH

Fall time: 1 V/ns

Rise Time: 1 V/ns

Data Retention Waveform

Notes:

7. Tested initially and after any design or process changes that may affect these parameters.

8. Full Device AC operation requires linear VCC ramp from VDR to VCC(min.) > 100 µs or stable at VCC(min.) > 100 µs.

1.5V

tCDR

VDR>1.5 V

DATA RETENTION MODE

VCC VCC (min.)

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