Cypress 32-pin 450 MIL Molded SOIC, MoBL CY62148EV30, Package Diagrams continued, Page 10 of

MoBL® CY62148EV30

Package Diagrams (continued)

Figure 8. 32-pin (450 MIL) Molded SOIC (51-85081)

16 1

0.546[13.868]

0.566[14.376]

0.440[11.176]

0.450[11.430]

17 32

0.793[20.142]

0.817[20.751]

0.101[2.565]

0.111[2.819]

0.004[0.102]

0.050[1.270]

MIN.

BSC.

0.014[0.355]

0.020[0.508]

SEATING PLANE

0.006[0.152]

0.012[0.304]

0.118[2.997]

MAX.

0.004[0.102]

0.047[1.193]

0.063[1.600]

0.023[0.584]

0.039[0.990]

51-85081-*B

Document #: 38-05576 Rev. *G Page 10 of 12

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