Cypress CY62148EV30 Thermal Resistance, AC Test Loads and Waveforms, Data Retention Waveform

MoBL® CY62148EV30

Capacitance (For All packages) [10]

Parameter	Description	Test Conditions	Max	Unit
CIN	Input Capacitance	TA = 25°C, f = 1 MHz,	10	pF
		VCC = VCC(typ)
COUT	Output Capacitance		10	pF

Thermal Resistance [10]

Parameter	Description	Test Conditions	VFBGA	TSOP II	SOIC	Unit
			Package	Package	Package
ΘJA	Thermal Resistance	Still Air, soldered on a 3 x 4.5 inch,	72	75.13	55	°C/W
	(Junction to Ambient)	two-layer printed circuit board
ΘJC	Thermal Resistance		8.86	8.95	22	°C/W
	(Junction to Case)

AC Test Loads and Waveforms

R1

VCC

ALL INPUT PULSES

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

		VCC
	10%				90%
R2
		GND
	Rise Time = 1 V/ns
Equivalent to:	THEVENIN EQUIVALENT
OUTPUT			RTH	V

90%

10%

Fall Time = 1 V/ns

Parameters	2.50V	3.0V	Unit
R1	16667	1103	Ω
R2	15385	1554	Ω
RTH	8000	645	Ω
VTH	1.20	1.75	V

Data Retention Characteristics (Over the Operating Range)

Parameter	Description			Conditions		Min	Typ [4]	Max	Unit
VDR	VCC for Data Retention					1.5			V
ICCDR [9]	Data Retention Current	VCC = 1.5V,		> VCC – 0.2V,	Ind’l/Auto-A		0.8	7	μA
			CE
		VIN > VCC – 0.2V or VIN <
		0.2V
tCDR [10]	Chip Deselect to Data Retention Time					0			ns
t [11]	Operation Recovery Time					t			ns
R						RC

Data Retention Waveform

		VCC(min)	DATA RETENTION MODE		VCC(min)
V	CC		V	> 1.5V
		tCDR	DR		tR
CE

Notes

10.Tested initially and after any design or process changes that may affect these parameters.

11.Full device AC operation requires linear VCC ramp from VDR to VCC(min) > 100 μs or stable at VCC(min) > 100 μs.

Document #: 38-05576 Rev. *G Page 4 of 12

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