CY62157ESL MoBL®
Document #: 001-43141 Rev. ** Page 4 of 12
Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Parameter Description Test Conditions Max Unit
CIN Input Capacitance TA = 25°C, f = 1 MHz, VCC = VCC(typ) 10 pF
COUT Output Capacitance 10 pF
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Parameter Description Test Conditions TSOP II Unit
ΘJA Thermal Resistance
(Junction to Ambient) Still Air, soldered on a 3 × 4.5 inch, two-layer
printed circuit board 77 °C/W
ΘJC Thermal Resistance
(Junction to Case) 13 °C/W
AC Test Loads and Waveforms
Parameters 2.5V 3.0V 5.0V Unit
R1 16667 1103 1800 Ω
R2 15385 1554 990 Ω
RTH 8000 645 63 9 Ω
VTH 1.20 1.75 1.77 V
VCC VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10% 90%
10%
Rise Time = 1 V/ns Fall Time = 1 V/ns
OUTPUT V
Equivalent to: THÉ VENIN EQUIVALENT
ALL INPUT PULSES
RTH
R1
TH
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