CY62167DV18 MoBL®
Document #: 38-05326 Rev. *C Page 4 of 11
Thermal Resistance [7]
Parameter Description Test Conditions VFBGA Unit
ΘJA Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
55 °C/W
ΘJC Thermal Resistance
(Junction to Case)
16 °C/W
AC Test Loads and WaveformsVCC
VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns Fall Time = 1 V/ns
OUTPUT V
Equivalentto: THE VENINEQUIVALENT
ALL INPUT PULSES
RTH
R1
Parameters 1.8V Unit
R1 13500 Ω
R2 10800 Ω
RTH 6000 Ω
VTH 0.80 V
Data Retention Characteristics (Over the Operating Range)
Parameter Description Conditions Min Typ [2] Max Unit
VDR VCC for Data Retention 1.0 1.95 V
ICCDR Data Retention Current VCC= 1.0V, CE1 > VCC – 0.2V, CE2 < 0.2V,
VIN > VCC – 0.2V or VIN < 0.2V
10 µA
tCDR[7] Chip Deselect to Data Retention Time 0 ns
tR[8] Operation Recovery Time tRC ns
Data Retention Waveform[9]
VCC, min
VCC, min
tCDR
VDR >1.0V
tR
CE1 or
VCC
BHE,BLE
or
CE2
DATA RETENTION MODE
Notes
8. Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 µs or stable at VCC(min) > 100 µs.
9. BHE.BLE is the AND of both BHE and BLE. Deselect the chip by either disabling the chip enable signals or by disabling both BHE and BLE.
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