Package Diagrams, Lead 600-mil Molded DIP P15

CY62256

Package Diagrams

51-85017-A

51-85092-*B

Document #: 38-05248 Rev. *B

Page 9 of 11

Image 9

Contents

Cypress Semiconductor Corporation FeaturesInputbuffer Column Electrical Characteristics Over the Operating Range Pin ConfigurationsMaximum Ratings Operating Range Capacitance4 Data Retention CharacteristicsAC Test Loads and Waveforms Data Retention Waveform Switching Waveforms Switching Characteristics Over the Operating Range6CY62256− Parameter Description Min Max Unit Read Cycle Write Cycle9 Read Cycle No 12 Write Cycle No WE ControlledWrite Cycle No CE Controlled Write Cycle No WE Controlled, OE LOW Typical DC and AC Characteristics Truth Table Inputs/Outputs Mode PowerOrdering Information Normalized Supply Voltage Package Diagrams Lead 600-mil Molded DIP P15Lead 300-mil SNC Narrow Body SN28 Lead Thin Small Outline Package Type 1 8 x 13.4 mm Z28 Date Change Description of Change REV ECN no