CY7C1410AV18, CY7C1425AV18
CY7C1412AV18, CY7C1414AV18

Document #: 38-05615 Rev. *E Page 27 of 29

Package Diagram

Figure 6. 165-Ball FBGA (15 x 17 x 1.4 mm), 51-85195

A
1
PIN1CORNER
17.00±0.10
15.00±0.10
7.00
1.00
Ø0.50 (165X)
Ø0.25MC A B
Ø0.05MC
B
A
0.15(4X)
0.35±0.06
1.40MAX.
SEATINGPLANE
0.53±0.05
0.25C
0.15C
PIN1CORNER
TOPVIEW BOTTOMVIEW
2345678910
10.00
14.00
B
C
D
E
F
G
H
J
K
L
M
N
11
1110986754321
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
C
1.00
5.00
0.36
+0.14
-0.06
SOLDERPADTYPE : NON SOLDER MASK DEFINED (NSMD)
NOTES:
PACKAGEWEIGHT: 0.65g
JEDECREFERENCE: MO-216 / DESIGN 4.6C
PACKAGECODE: BB0AD
51-85195-*A

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