Cypress manual Thermal Resistance, CY7C1541V18, CY7C1556V18 CY7C1543V18, CY7C1545V18, Package

CY7C1541V18, CY7C1556V18

CY7C1543V18, CY7C1545V18

Thermal Resistance

Tested initially and after any design or process change that may affect these parameters.

Parameter	Description		Test Conditions	165 FBGA	Unit
				Package
ΘJA	Thermal Resistance		Test conditions follow standard test methods and	11.82	°C/W
	(Junction to Ambient)		procedures for measuring thermal impedance, in
			accordance with EIA/JESD51.
ΘJC	Thermal Resistance			2.33	°C/W
	(Junction to Case)
		Figure 4. AC Test Loads and Waveforms

VREF = 0.75V

VREF	0.75V
OUTPUT	Z0 = 50Ω
Device
Under
Test

ZQ

RQ =

250Ω

(a)

RL = 50Ω

VREF = 0.75V

VREF		0.75V			R = 50Ω
OUTPUT							ALL INPUT PULSES[23]
						1.25V
Device					5 pF 0.25V			0.75V
Under	ZQ						Slew Rate = 2 V/ns
Test			RQ =
			250Ω
INCLUDING
JIG AND				(b)
SCOPE

Note

23.Unless otherwise noted, test conditions assume signal transition time of 2V/ns, timing reference levels of 0.75V, Vref = 0.75V, RQ = 250Ω, VDDQ = 1.5V, input pulse levels of 0.25V to 1.25V, and output loading of the specified IOL/IOH and load capacitance shown in (a) of AC Test Loads and Waveforms.

Document Number: 001-05389 Rev. *F Page 22 of 28

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