Document Number: 001-06551 Rev. *E Revised March 11, 2008 Page 28 of 28
QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress, IDT, NEC, Renesas, and Samsung. All product and company names mentioned in this document
are the trademarks of their respective holders.
CY7C1566V18, CY7C1577V18
CY7C1568V18, CY7C1570V18
© Cypress Semiconductor Corporation, 2006-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used
for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement w i th Cy press. Furthermore, Cypress does not authorize its products for use
as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support
systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a person al, non- ex clusi ve, non-transfe rable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or repr esentation of th is Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical compone nt s in life-support systems whe re
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document History Page
Document Title: CY7C1566V18/CY7C1577V18/CY7C1568V18/CY7C1570V18, 72-Mbit DDR-II+ SRAM 2-Word Burst Architec-
ture (2.5 Cycle Read Latency)
Document Number: 001-06551
REV. ECN No. Issue
Date Orig. of
Change Description of Change
** 432718 See ECN NXR New datasheet
*A 437000 See ECN IGS ECN to show on web
*B 461934 See ECN NXR Changed tTH and tTL from 40 n s to 20 ns, changed tTMSS, tTDIS, tCS, tTMSH, tTDIH, tCH
from 10 ns to 5 ns, and changed tTDOV from 20 ns to 10 ns in TAP AC Switching
Characteristics table
Modified power up waveform
*C 497567 See ECN NXR Changed the VDDQ operating voltage to 1.4V to VDD in the Features section, Operating
Range table, and the DC Electrical Characteristics table
Added foot note in page 1
Changed the Maximum rating of ambient temperature with power applied from –10°C
to +85°C to –55°C to +125°C
Changed VREF (Max) specification from 0.85V to 0.95V in the DC Electrical Character-
istics table and in the note below the table
Updated footnote 18 to specify overshoot and undershoot specification
Updated IDD and ISB values
Updated ΘJA and ΘJC values
Removed x9 part and its related information
Updated footnote 25
*D 1 351504 See ECN VKN/AESA Converted from preliminary to final
Added x8 and x9 parts
Updated logic block diagram for x18 and x36 parts
Changed tCYC max spec to 8.4 ns for all speed bins
Updated footnote# 21
Updated Ordering Information table
*E 2193266 See ECN VKN/AESA Added footnote# 20 related to IDD
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