Cypress CY8C24094, CY8C24894, CY8C24994 11.1 Thermal Impedance, 11.2 Solder Reflow Peak Temperature

CY8C24094, CY8C24794
CY8C24894, CY8C24994
Document Number: 38-12018 Rev. *M Page 41 of 47
11.1 Thermal Impedance
11.2 Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 11-1. Thermal Impedance for the Package
Package Typic al θJA [15]
56 QFN[16] 12.93 oC/W
68 QFN[16] 13.05 oC/W
100 VFBGA 65 oC/W
100 TQFP 51 oC/W
Table 11-2. Solder Reflow Peak Temperature
Package Minimum Peak Temperature[17] Maximum Peak Temperature
56 QFN 240oC260oC
68 QFN 240oC260oC
100 VFBGA 240oC260oC
Notes
15.TJ = TA + POWER x θJA
16.To achieve the thermal impedance specified for the QFN package, the center thermal pad should be soldered to the PCB ground plane.
17.Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5oC with Sn-Pb or 245 ± 5oC with Sn-Ag-Cu paste.
Refer to the solder manufacturer specifications
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