CY8C24094, CY8C24794

CY8C24894, CY8C24994

11.1 Thermal Impedance

Table 11-1. Thermal Impedance for the Package

Package

Typical θJA [15]

56 QFN[16]

12.93 oC/W

68 QFN[16]

13.05 oC/W

100 VFBGA

65 oC/W

100 TQFP

51 oC/W

11.2 Solder Reflow Peak Temperature

Following is the minimum solder reflow peak temperature to achieve good solderability.

Table 11-2. Solder Reflow Peak Temperature

Package

Minimum Peak Temperature[17]

Maximum Peak Temperature

56 QFN

240oC

260oC

68 QFN

240oC

260oC

100 VFBGA

240oC

260oC

Notes

15.TJ = TA + POWER x θJA

16.To achieve the thermal impedance specified for the QFN package, the center thermal pad should be soldered to the PCB ground plane.

17.Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5oC with Sn-Pb or 245 ± 5oC with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications

Document Number: 38-12018 Rev. *M

Page 41 of 47

[+] Feedback

Page 41
Image 41
Cypress CY8C24894, CY8C24994 manual Solder Reflow Peak Temperature, Thermal Impedance for the Package Typical θJA, Vfbga

CY8C24094, CY8C24894, CY8C24994 specifications

The Cypress CY8C24994, CY8C24894, and CY8C24094 are part of the PSoC (Cypress Semiconductor's Programmable System-on-Chip) family, designed to integrate numerous functions onto a single chip for efficient performance and flexibility in various applications.

One of the key features of these devices is their combination of analog and digital components, allowing designers to create a customized system without the need for extensive external circuitry. Each of these chips incorporates an Arm Cortex-M3 processor core, which provides a powerful 32-bit architecture, enabling efficient execution of 32-bit operations while maintaining low power consumption.

The CY8C24994 is the most advanced in this series, supporting up to 128 GPIO (General Purpose Input/Output) pins, which enhances connectivity options. It features multiple programmable analog blocks, including op-amps, comparators, and DACs (Digital-to-Analog Converters), making it suitable for a variety of sensor interfacing and signal processing applications. Additionally, it supports USB communication, providing further versatility for applications requiring data exchange with a host device.

The CY8C24894 presents a slightly more cost-effective solution with slightly fewer GPIO pins and integrated features. It maintains many of the same core attributes as its counterpart, delivering excellent analog performance and several programmable digital blocks. It is suitable for applications requiring moderate computational capabilities along with flexibility in terms of peripherals and interfaces.

The CY8C24094, while positioned as a more basic option within this lineup, still provides essential functionalities for simpler tasks. With fewer pins and capabilities, it is ideal for applications where size and cost are more critical than extensive processing power.

All three devices utilize Cypress's proprietary CapSense technology, enabling touch-sensing capabilities without the need for mechanical buttons. This feature not only enhances user interaction but also contributes to the overall design's robustness and longevity.

In summary, the CY8C24994, CY8C24894, and CY8C24094 PSoC chips offer ample design flexibility with integrated analog and digital functionality, making them an excellent choice for developers aiming to create innovative embedded solutions across a wide range of applications, from consumer electronics to industrial control systems.