STK11C88
Package Diagrams
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Figure 11. 28-Pin (300 mil) SOIC (51-85026)
NOTE :
| PIN 1 ID | 1. JEDEC STD REF |
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| 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT | |
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| DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE. | |
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| MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE | |
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| 3. DIMENSIONS IN INCHES | MIN. |
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| 0.291[7.39] |
| 4. PACKAGE WEIGHT 0.85gms | MAX. | ||
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| 0.300[7.62] |
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15 | 28 | ||
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0.697[17.70]
0.713[18.11]
| 0.013[0.33] |
0.050[1.27] | 0.019[0.48] |
TYP. |
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0.394[10.01] * 0.419[10.64]
0.026[0.66]
0.032[0.81]
SEATING PLANE
0.092[2.33]
0.105[2.67]
0.004[0.10] 0.004[0.10] * 0.0118[0.30]
PART #
S28.3 STANDARD PKG.
SZ28.3 LEAD FREE PKG.
0.015[0.38]
0.050[1.27]
0.0091[0.23]
0.0125[3.17]
*
51 85127 *A
Document Number: | Page 13 of 15 |
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