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The entire enclosed product is called the Pentium® II or Pentium® III Processor. The packaging technology and each of the physical elements of the product are referred to using accurate technical descriptions. This allows clear reference to the products as just a processor. This is the model used in past packaging tech- nologies like PGA, TCP, PQFP, DIP, etc.
S.E.C. Cartridge Terminology
• Pentium ® II or Pentium® III Processor
The new enclosed card packaging technology is called a “Single Edge Contact cartridge.” This is similar to previous names for packaging technology such as PGA or TCP.
• Processor card
The green PCB (with or without components on it)
• Processor core
The silicon on the PLGA package on the PCB
• Cover
The plastic cover on the opposite side from the thermal plate.
• Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium® Pro processor uses Socket 8.
• Retention mechanism
Formerly ‘retention module’ the dual posts, etc. that holds the cartridge in place.
• Thermal plate
The heatsink attachment plate.
• Heat sink supports
The support pieces that are mounted on the mainboard to provide added support for heatsinks.
Thermal Plate
Cover
Figure 1:
Pentium® II or Pentium® III Processor
CPU with S.E.C. Cartridge
Processor
Printed Circuit Board
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