EPoX Computer EP-6VBA specifications Overview, Introduction, Pentium II or Pentium III Processor

Introduction EP-6VBA

Overview

Pentium® II or Pentium® III Processor

The Pentium® II or Pentium® III Processor is the follow-on to the Pentium® Processor. The Pentium® II or Pentium® III Processor, like the Pentium® Pro processor, implements a Dynamic Execution micro-architecture -- a unique combination of multiple branch prediction, data flow analysis, and speculative execution. This enables the Pentium® II Processor to deliver higher performance than the Pentium® processor, while maintaining binary compatibility with all previous Intel architecture processors.

A significant feature of the Pentium® II or Pentium® III Processor, from a system perspective, is the built-in direct multiprocessing support. In order to achieve multiprocessing, and maintain the memory and I/O bandwidth to support it, new system designs are needed. For systems with dual processors, it is important to consider the additional power burdens and signal integrity issues of supporting multiple loads on a high speed bus. The Pentium® II or Pentium® III Processor can supports both uni-processor and dual processor implementations.

The Pentium® II or Pentium® III Processor utilizes Single Edge Contact (S.E.C.) (Figure 1) cartridge packaging technology. The S.E.C. cartridge allows the L2 cache to remain tightly coupled to the processor, while maintaining flexibility when implementing high performance processors into OEM systems. The second level cache is performance optimized and tested at the cartridge level. The S.E.C. cartridge utilizes surface mounted core components and a printed circuit board with an edge finger connection. The S.E.C. cartridge package introduced on the Pentium® II Processor will also be used in future Slot 1 processors.

The S.E.C. cartridge has the following features: a thermal plate, a cover and a PCB with an edge finger connection. The thermal plate allows standardized heatsink attachment or customized thermal solutions. The thermal plate enables a reusable heatsink to minimize fit issues for serviceability, upgradeability and replacement. The full enclosure also protects the surface mount components. The edge finger connection maintains socketabilty for system configuration. The edge finger connector is denoted as ‘Slot 1 connector’ in this and other documentation.

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