1.3 Troubleshooting Procedure
1.3.3 Troubleshooting at factory
When the trouble is recovered by replacing the drive at field (Subsection 1.3.2), troubleshoot the replaced drive to isolate the trouble to the subassembly parts.
To shorten the troubleshooting time and repairing time, gather the data, such as environmental data and other information, from the user and then return the failed drive to the factory to repair.
At the factory, user environment is made and a reappearance test is performed. To reappearance a same trouble at user, the failed drive is connected to the host system. If no trouble occurs by the normal test, the reappearance test is performed by adding the voltage/temperature load using a disk drive tester or tools according to the user environment.
When a trouble reappeared, troubleshoot the cause of failure. Then, replace the failed unit or parts.
As this level maintenance is made by a factory, this maintenance level is beyond the scope of this manual.
Device damage
The disk enclosure (DE) must never to be opened in the field.
Opening the disk enclosure may cause irreparable damage.
