4.Remove the fan/heat sink assembly (3).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system board each time the fan/heat sink assembly is removed:
●Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●Thermal pads are used on the graphics subsystem chip (3) and the heat sink section (4) that services it
●Thermal pads are used on the system board capacitors (5) and the heat sink section (6) that services them
Replacement thermal material is included with all fan/heat sink assembly, system board, and processor spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
ENWW | Component replacement procedures 65 |
