5.Following the 1, 2, 3, 4 sequence stamped into the fan/heat sink assembly, loosen the four captive Philllips screws (2) that secure the fan/heat sink assembly to the system board, and then remove the fan/heat sink assembly (3).

NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink assembly and system board components, it may be necessary to move the fan/heat sink assembly from side to side to detach it.

NOTE: The following illustration shows the fan/heat sink assembly removal process for a computer model equipped with an AMD processor. The process for removing the fan/heat sink assembly on a computer model equipped with an Intel processor is identical.

NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink

and the system board components each time the heat sink is removed. Replacement thermal material is included with the fan/heat sink assembly, processor, and system board spare part kits. Replacement thermal material is also available in the Thermal Material Kit, spare part numbers 685348-001 (for use on computer models equipped with an AMD processor) and 682100-001 (for use on computer models equipped with an Intel processor).

NOTE: The following illustration shows the replacement thermal material locations on a computer model equipped with an AMD processor and a graphics subsystem with discrete memory.

●Thermal paste is used on the processor (1) and the heat sink section (2) that services it

●Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that services it

●Thermal pads are used on the system board components (5) and the heat sink sections (6) that service them

Component replacement procedures

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