2.1.3 Copper and CMOS technology
Copper is a superior conductor of electricity, making it possible to shrink electronic devices even further while increasing performance. It has less resistance than aluminum and, therefore, allows designs that transmit electrical signals faster. However, it does not mix as well with silicon, the base material of semiconductor chips. IBM researchers found a way to put a microscopic barrier between the copper and silicon in a way that actually reduced the number of steps needed to complete a chip. With this development, IBM is able to squeeze down the widths of copper wires to the
-a reduction far more difficult for aluminum. A single
2.1.4Processor deallocation
In general, there are two options available to deallocate a processor within an SMP system, which are described in more detail in the following sections:
1.Processor Boot Time Deconfiguration
2.Processor
The capability of Dynamic Processor Deallocation is only active in systems with more than two processors, because device drivers and kernel extensions, which are common to
Processor boot time deconfiguration within an SMP system
Processor boot time deconfiguration within an SMP system is a function implemented in the system and service processor firmware of the Models 6C1 and 6E1 for deallocating a processor from the system configuration at boot time. The objective is to minimize system failure or data integrity exposure due to a faulty processor.
The processor that is deconfigured remain offline for subsequent reboots until the faulty processor hardware is replaced. This function provides the option for a user to manually deconfigure or
Note: Processor cards only can physically be removed when the power is turned off to the entire system.
If the system processor in slot 1
How to disable the second processor manually
A additional processor in Models 6C1 and 6E1 can be disabled only within the Service Processor menus. There is no need to remove them from the system. The cpu_state command, used on the
Chapter 2. Architecture and technical overview | 11 |