IBM C1B 1.12 Brick On Sled Carrier 128-pin HPC, C1C 1.12 3.5-inch Small FF 38-pin Unitized, C2B 2.25 Brick On Sled carrier 128-pin HPC, C4B 4.51 Brick On Sled carrier 128-pin HPC, C4C 4.51 3.5-inch Small FF 38-pin Unitized, SSA - page 71

USER RESPONSIBLE FOR VERIFYING VERSION AND COMPLETENESS

OEM FUNCTIONAL SPECIFICATION ULTRASTAR XP (DFHC) SSA MODELS 1.12/2.25 GB -1.0" HIGH

Termination

Bus termination of the - SYNC signals is internal to the drive. This signal has a 5.1K ohm pulled-up to

the + 5 volt supply. A maximum of30 drives can have their - SYNC line daisy chained together. Vio-

lating this could damage the Master drive line driver on the - SYNC line

It is the using system's responsibility to provide the cable to connect the - SYNC line where needed, of

the synchronized drives.

Bus Characteristics

−maximum Bus length = 6 meters

−2 micro-second negative active pulse (when sourced by drive)

−minimum of 1 micro-second negative active pulse when externally sourced

−0.8 volts = valid low input

−2.2 volts = valid hig h input

−0.4 volts = low output

−Vcc volts = High output

−30 milli-amps = maximum output lowlevel sink current

The driver used for these two signal lines is a Open Drain buffer.

Source filename=SYNC IBM Corporation Page 71 of 87

Contents

Main Page Preface Page Contents Page Page Page 1.0 Description 1.1 Features 1.1.1 General Features 1.1.2 Performance Summary 1.1.3 Interface Controller Features 1.2 Models 2.0 Specifications 2.1 General Page 2.1.1 Capacity Equations 2.1.1.1 For Each Notch 2.1.1.2 For Entire Drive 2.2 Power Requirements by Model 2.2.1 C1x Models 2.2.1.1 Power Calculation Examples Page Page Page Page 2.2.2 C2x Models 2.2.2.1 Power Calculation Examples Page Page Page Page 2.2.3 C4x Models 2.2.3.1 Power Calculation Examples Page Page Page Page 2.2.4 CxB Models 2.2.4.1 Power supply methods 2.2.4.2 DC/DC Converter 2.2.5 Power Supply Ripple 2.2.6 Grounding Requirements of the Disk Enclosure 2.2.7 Hot plug/unplug support Page 2.2.8 Bring-up Sequence (and Stop) Times Page Page 3.0 Performance 3.1 Environment Definition 3.2 Workload Definition 3.2.1 Sequential 3.2.2 Random 3.3 Command Execution Time 3.3.1 Basic Component Descriptions Page 3.3.2 Comments 3.3.2.1 Theoretical Data Sector Transfer Rate 3.4 Approximating Performance for Different Environments 3.4.1 For Different Transfer Sizes 3.4.2 When Read Caching is Enabled 3.4.3 When Write Caching is Enabled 3.4.4 When Adaptive Caching is Enabled 3.4.5 When Read-ahead is Enabled 3.4.6 When No Seek is Required 3.4.7 For Queued Commands 3.4.7.1 Reordered Commands 3.4.7.2 Back-To-Back Commands 3.4.8 Out of Order Transfers 3.5 Skew 3.5.1 Cylinder to Cylinder Skew 3.5.2 Track to Track Skew 3.6 Idle Time Functions 3.6.1 Servo Run Out Measurements 3.6.2 Servo Bias Measurements 3.6.3 Predictive Failure Analysis 3.6.4 Channel Calibration 3.6.5 Save Logs and Pointers 3.7 Command Timeout Limits Page 4.0 Mechanical 4.1 Small Form Factor Models (CxC) 4.1.1 Weight and Dimensions 4.1.2 Clearances 4.1.3 Mounting Page Page Page Page Page 4.2 Carrier Models (CxB) 4.2.1 Weight and Dimensions 4.2.2 Clearances 4.2.3 Mounting Page Page 4.2.4 Auto-docking Assembly Side Rails Page Page 5.0 Electrical Interface 5.1 SSA Unitized Connector 5.2 Carrier Connector Page 5.3 SSA Link Cable 5.4 SSA Link Electrical Characteristics 5.5 Option Pins and Indicators 5.5.1 - Manufacturing Test Mode (Option Port Pin 1) 5.5.2 - Auto Start Pin (Option Port Pin 2) 5.5.4 - Write Protect (Option Port Pin 4) 5.5.5 - Ground long (Option Port Pin 5) 5.5.6 - Device Activity Pin/Indicator (Option Port Pin 6) 5.5.7 + 5V (Option Port Pin 7) 5.5.8 - Device Fault Pin/Indicator (Option Port Pin 8) 5.6 Front Jumper Connector 5.7 Spindle Synchronization 5.7.1 Synchronization overview 5.7.2 Synchronization Mode 5.7.3 Synchronization time 5.7.4 Synchronization with Offset 5.7.5.2 Over Sync Hard-wire Page Page 6.0 Reliability 6.1 Error Detection 6.2 Data Reliability 6.3 Seek Error Rate 6.4 Power On Hours Examples: Page 6.7 *Mean Time Between Failure (*MTBF) 6.7.1 Sample Failure Rate Projections 6.8 SPQL (Shipped product quality level) 6.9 Install Defect Free Page 7.0 Operating Limits 7.1 Environmental 7.1.1 Temperature Measurement Points Page 7.2 Vibration and Shock 7.2.1 Drive Mounting Guidelines 7.2.2 Output Vibration Limits 7.2.3 Operating Vibration 7.2.3.1 Nonoperating Vibration 7.2.4 Operating Shock 7.2.5 Nonoperating Shock 7.3 Contaminants 7.4 Acoustic Levels Page 8.0 Standards 8.1 Safety 8.2 Electromagnetic Compatibility (EMC) Page Bibliography