IBM C1B 1.12 Brick On Sled Carrier 128-pin HPC, C1C 1.12 3.5-inch Small FF 38-pin Unitized, C2B 2.25 Brick On Sled carrier 128-pin HPC, C4B 4.51 Brick On Sled carrier 128-pin HPC, C4C 4.51 3.5-inch Small FF 38-pin Unitized, SSA - page 78

USER RESPONSIBLE FOR VERIFYING VERSION AND COMPLETENESS

OEM FUNCTIONAL SPECIFICATION ULTRASTAR XP (DFHC) SSA MODELS 1.12/2.25 GB -1.0" HIGH

Table 15. Maximum and Reliability Operating Temperature Limits

Maximum Reliability

Disk Enclosure Top 158˚ F (70˚C) 131˚ F (55˚C)

Disk Enclosure Bottom 158˚F (70˚C ) 131˚F (55˚ C)

PRDF Prime Module 203˚F (95˚ C) 176˚F (80˚ C)

WD 61C40 Mod ule 185˚ F (85˚C) 167˚ F (75˚c)

SIC Module 203˚F (95˚C) 176˚F (80˚ C)

Microprocessor Module 194˚F (90˚C) 167˚ F (75˚C)

VCM FET 194˚F (90˚C ) 167˚F (75˚ C)

DC/DC Converter (CxB only) 185˚F (85˚C) 167˚ F (75˚C)

SMP FET 194˚F (90˚ C) 167˚F (75˚ C)

Note 1: Module temperature measurements should be taken from the t op surface of the module.

Note 2: If copper tape is used to attach temperature sensors, it should be no larger than 6 square milli-

meters.

notes: 1) dimensions are in millimeters.

Figure 22. Temperature Measurement Points for All Models (top view of DE)

Source filename=OPLIMITSIBM CorporationPage 78 of 87

Contents

Main Page Preface Page Contents Page Page Page 1.0 Description 1.1 Features 1.1.1 General Features 1.1.2 Performance Summary 1.1.3 Interface Controller Features 1.2 Models 2.0 Specifications 2.1 General Page 2.1.1 Capacity Equations 2.1.1.1 For Each Notch 2.1.1.2 For Entire Drive 2.2 Power Requirements by Model 2.2.1 C1x Models 2.2.1.1 Power Calculation Examples Page Page Page Page 2.2.2 C2x Models 2.2.2.1 Power Calculation Examples Page Page Page Page 2.2.3 C4x Models 2.2.3.1 Power Calculation Examples Page Page Page Page 2.2.4 CxB Models 2.2.4.1 Power supply methods 2.2.4.2 DC/DC Converter 2.2.5 Power Supply Ripple 2.2.6 Grounding Requirements of the Disk Enclosure 2.2.7 Hot plug/unplug support Page 2.2.8 Bring-up Sequence (and Stop) Times Page Page 3.0 Performance 3.1 Environment Definition 3.2 Workload Definition 3.2.1 Sequential 3.2.2 Random 3.3 Command Execution Time 3.3.1 Basic Component Descriptions Page 3.3.2 Comments 3.3.2.1 Theoretical Data Sector Transfer Rate 3.4 Approximating Performance for Different Environments 3.4.1 For Different Transfer Sizes 3.4.2 When Read Caching is Enabled 3.4.3 When Write Caching is Enabled 3.4.4 When Adaptive Caching is Enabled 3.4.5 When Read-ahead is Enabled 3.4.6 When No Seek is Required 3.4.7 For Queued Commands 3.4.7.1 Reordered Commands 3.4.7.2 Back-To-Back Commands 3.4.8 Out of Order Transfers 3.5 Skew 3.5.1 Cylinder to Cylinder Skew 3.5.2 Track to Track Skew 3.6 Idle Time Functions 3.6.1 Servo Run Out Measurements 3.6.2 Servo Bias Measurements 3.6.3 Predictive Failure Analysis 3.6.4 Channel Calibration 3.6.5 Save Logs and Pointers 3.7 Command Timeout Limits Page 4.0 Mechanical 4.1 Small Form Factor Models (CxC) 4.1.1 Weight and Dimensions 4.1.2 Clearances 4.1.3 Mounting Page Page Page Page Page 4.2 Carrier Models (CxB) 4.2.1 Weight and Dimensions 4.2.2 Clearances 4.2.3 Mounting Page Page 4.2.4 Auto-docking Assembly Side Rails Page Page 5.0 Electrical Interface 5.1 SSA Unitized Connector 5.2 Carrier Connector Page 5.3 SSA Link Cable 5.4 SSA Link Electrical Characteristics 5.5 Option Pins and Indicators 5.5.1 - Manufacturing Test Mode (Option Port Pin 1) 5.5.2 - Auto Start Pin (Option Port Pin 2) 5.5.4 - Write Protect (Option Port Pin 4) 5.5.5 - Ground long (Option Port Pin 5) 5.5.6 - Device Activity Pin/Indicator (Option Port Pin 6) 5.5.7 + 5V (Option Port Pin 7) 5.5.8 - Device Fault Pin/Indicator (Option Port Pin 8) 5.6 Front Jumper Connector 5.7 Spindle Synchronization 5.7.1 Synchronization overview 5.7.2 Synchronization Mode 5.7.3 Synchronization time 5.7.4 Synchronization with Offset 5.7.5.2 Over Sync Hard-wire Page Page 6.0 Reliability 6.1 Error Detection 6.2 Data Reliability 6.3 Seek Error Rate 6.4 Power On Hours Examples: Page 6.7 *Mean Time Between Failure (*MTBF) 6.7.1 Sample Failure Rate Projections 6.8 SPQL (Shipped product quality level) 6.9 Install Defect Free Page 7.0 Operating Limits 7.1 Environmental 7.1.1 Temperature Measurement Points Page 7.2 Vibration and Shock 7.2.1 Drive Mounting Guidelines 7.2.2 Output Vibration Limits 7.2.3 Operating Vibration 7.2.3.1 Nonoperating Vibration 7.2.4 Operating Shock 7.2.5 Nonoperating Shock 7.3 Contaminants 7.4 Acoustic Levels Page 8.0 Standards 8.1 Safety 8.2 Electromagnetic Compatibility (EMC) Page Bibliography