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Intel 200 Equation 3 JA = JS + HS_BASE + S-TOP-A , Equation 4 (JA JS HS_BASE) PD + TA = TS-TOP-MAX

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Thermal Metrology

28 Thermal and Mechanical Design Guidelines

For reference thermal solution of Intel Celeron processor 200 sequence on Intel

Desktop Board D201GLY2, the junction-to-local ambient thermal characterization

parameter of the processor, ΨJA, is comprised of ΨJS, the thermal interface material

thermal characterization parameter, ΨHS_BASE the thermal characterization parameter

of the heatsink base from bottom center of heatsink base to top center of heatsink

base surface, and of ΨS-TOP-A, the sink-to-local ambient thermal characterization

parameter:

Equation 3 ΨJA = ΨJS + ΨHS_BASE + ΨS-TOP-A

Where:

ΨJS = Thermal characterization parameter of the thermal interface material

(°C/W)

Ψ HS_BASE = Thermal characterization parameter of the heatsink base (°C/W)

ΨS-TOP-A = Thermal characterization parameter from heatsink top to local

ambient (°C/W)

ΨJS is strongly dependent on the thermal conductivity, thickness and performance

degradation across time of the TIM between the heatsink and processor die.

Ψ HS_BASE is a measure of the thermal characterization parameter of the heatsink base.

It is dependent on the heatsink base material, thermal conductivity, thickness and

geometry.

ΨS-TOP-A is a measure of the thermal characterization parameter from the top center

point of the heatsink base to the local ambient air. ΨS-TOP-A is dependent on the

heatsink material, thermal conductivity, and geometry. It is also strongly dependent

on the air flow through the fins of the heatsink.

Equation 4 (ΨJA − ΨJS − ΨHS_BASE) × PD + TA = TS-TOP-MAX

With a given processor junction-to-local ambient requirement (ΨJA) and TIM

performance (ΨJS) and processor power consumption (PD), the processor’s heatsink

requirement (TS-TOP-MAX) could be defined by Equation 4.

Contents

Main Intel Celeron Processor 200 Sequence Page Contents Figures Tables Revision History 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management 1.1.2 Document Goals 1.1.3 Document Scope 1.2 Reference Documents .com/design/processo r/datashts/318546.ht m http://www.formfacto rs.org/ 1.3 Definition of Terms 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package Table 1. Micro-FCBGA Package Mechanical Specifications Page Page Page 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines 2.1.2.2 Heatsink Clip Load Requirement 2.1.2.3 Heatsink Attach Mechanism Design Considerations 2.2 Thermal Requirements 2.2.1 Processor Junction Temperature 2.3 Heatsink Design Considerations 2.3.1 Heatsink Size 2.3.2 Heatsink Mass 2.3.3 Thermal Interface Material 2.4 System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities Equation 1 TS-SYSTEM = TA + (TS-TOP TA) 16/PCPU TS-TOP-MAX = 91C 2.4.2 Improving Chassis Thermal Performance Page Page 2.4.3 Summary Page 3 Thermal Metrology 3.1 Characterizing Cooling Performance Requirements Equation 2 JA = (TJ TA) / PD Equation 3 JA = JS + HS_BASE + S-TOP-A Equation 4 (JA JS HS_BASE) PD + TA = TS-TOP-MAX 3.1.1 Example JA = (TJ TA) / TDP = (90 55) / 20 = 1.75 C/W SA = JA JS = 1.75 0.50 = 1.25 C/W TS-TOP-MAX = (jA jS HS_BASE) PD + TA = (1.25 0.30) 20 + 55 = 74 C 3.2 Local Ambient Temperature Measurement Guidelines Page 3.3 Processor Power Measurement Metrology Recommendation 3.3.1 Sample Preparation Equation 5 PD = VCC (Vi / RSENSE) Page Page Page 4 System Thermal/Mechanical Design Information 4.1 Overview of the Reference Design 4.1.1 Altitude 4.1.2 Heatsink Thermal Validation 4.2 Environmental Reliability Testing 4.2.1 Structural Reliability Testing 4.2.1.1 Random Vibration Test Procedure 3.13GRMS (10 minutes per axis) 4.2.1.2 Shock Test Procedure 4.2.1.2.1 Recommended Test Sequence 4.2.1.2.2 Post-Test Pass Criteria 4.2.2 Power Cycling 4.2.3 Recommended BIOS/CPU/Memory Test Procedures 4.3 Material and Recycling Requirements 4.4 Safety Requirements 4.5 Reference Attach Mechanism 4.5.1 Structural Design Strategy 4.5.2 Mechanical Interface to the Reference Attach Mechanism Page Appendix A Heatsink Clip Load Metrology A.1 Overview A.2 Test Preparation A.2.1 Heatsink Preparation A.2.2 Typical Test Equipment Table 5. Typical Test Equipment A.3 Test Procedure Examples Page Appendix B Intel Enabled Boxed Processor Thermal Solution Information Page Appendix C Mechanical Drawings