Intel 200 3.3 Processor Power Measurement Metrology Recommendation

Thermal Metrology

32 Thermal and Mechanical Design Guidelines

Figure 12. Locations for Measuring Local Ambient Temperature, Passive Heatsink

3MM AWAY FROM HE ATSINK SIDES

TOP VIEW

POTISTION THERMOCOUPLES (X4)

AT LOCATIONS AS INDICATED

TO MEASURE T

A

.

TC1

TC2

TC3

TC4

HALF OF HEATSINK FIN HEIGHT

SIDE VIEW

3MM AWAY FROM HE ATSINK SIDES

TOP VIEW

POTISTION THERMOCOUPLES (X4)

AT LOCATIONS AS INDICATED

TO MEASURE T

A

.

TC1

TC2

TC3

TC4

HALF OF HEATSINK FIN HEIGHT

SIDE VIEW

NOTE: Drawing Not to Scale

It is recommended that full and routine calibration of temperature measurement

equipment be performed before attempting to perform temperature measurement.

Intel recommends checking the meter probe set against known standards. This

should be done at 0 ºC (using ice bath or other stable temperature source) and at an

elevated temperature, around 80 ºC (using an appropriate temperature source).

Wire gauge and length also should be considered as some less expensive

measurement systems are heavily impacted by impedance. There are numerous

resources available throughout the industry to assist with implementation of proper

controls for thermal measurements.

3.3 Processor Power Measurement Metrology Recommendation

This section recommends a metrology to measure power consumption of the Intel

Celeron processor 200 sequence on the Intel Desktop Board D201GLY2. Should there

be any modification of motherboard layout or design, contact Intel field sales

representative or product marketing staff for clarification of this metrology.

Contents

Main Intel Celeron Processor 200 Sequence Page Contents Figures Tables Revision History 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management 1.1.2 Document Goals 1.1.3 Document Scope 1.2 Reference Documents .com/design/processo r/datashts/318546.ht m http://www.formfacto rs.org/ 1.3 Definition of Terms 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package Table 1. Micro-FCBGA Package Mechanical Specifications Page Page Page 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines 2.1.2.2 Heatsink Clip Load Requirement 2.1.2.3 Heatsink Attach Mechanism Design Considerations 2.2 Thermal Requirements 2.2.1 Processor Junction Temperature 2.3 Heatsink Design Considerations 2.3.1 Heatsink Size 2.3.2 Heatsink Mass 2.3.3 Thermal Interface Material 2.4 System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities Equation 1 TS-SYSTEM = TA + (TS-TOP TA) 16/PCPU TS-TOP-MAX = 91C 2.4.2 Improving Chassis Thermal Performance Page Page 2.4.3 Summary Page 3 Thermal Metrology 3.1 Characterizing Cooling Performance Requirements Equation 2 JA = (TJ TA) / PD Equation 3 JA = JS + HS_BASE + S-TOP-A Equation 4 (JA JS HS_BASE) PD + TA = TS-TOP-MAX 3.1.1 Example JA = (TJ TA) / TDP = (90 55) / 20 = 1.75 C/W SA = JA JS = 1.75 0.50 = 1.25 C/W TS-TOP-MAX = (jA jS HS_BASE) PD + TA = (1.25 0.30) 20 + 55 = 74 C 3.2 Local Ambient Temperature Measurement Guidelines Page 3.3 Processor Power Measurement Metrology Recommendation 3.3.1 Sample Preparation Equation 5 PD = VCC (Vi / RSENSE) Page Page Page 4 System Thermal/Mechanical Design Information 4.1 Overview of the Reference Design 4.1.1 Altitude 4.1.2 Heatsink Thermal Validation 4.2 Environmental Reliability Testing 4.2.1 Structural Reliability Testing 4.2.1.1 Random Vibration Test Procedure 3.13GRMS (10 minutes per axis) 4.2.1.2 Shock Test Procedure 4.2.1.2.1 Recommended Test Sequence 4.2.1.2.2 Post-Test Pass Criteria 4.2.2 Power Cycling 4.2.3 Recommended BIOS/CPU/Memory Test Procedures 4.3 Material and Recycling Requirements 4.4 Safety Requirements 4.5 Reference Attach Mechanism 4.5.1 Structural Design Strategy 4.5.2 Mechanical Interface to the Reference Attach Mechanism Page Appendix A Heatsink Clip Load Metrology A.1 Overview A.2 Test Preparation A.2.1 Heatsink Preparation A.2.2 Typical Test Equipment Table 5. Typical Test Equipment A.3 Test Procedure Examples Page Appendix B Intel Enabled Boxed Processor Thermal Solution Information Page Appendix C Mechanical Drawings