Intel 200 4.4 Safety Requirements , 4.5 Reference Attach Mechanism

System Thermal/Mechanical Design Information

Thermal and Mechanical Design Guidelines 41

4.4 Safety Requirements

Heatsink and attachment assemblies shall be consistent with the manufacture of units

that meet the safety standards:

• UL Recognition-approved for flammability at the system level. All mechanical and

thermal enabling components must be a minimum UL94V-2 approved.

• CSA Certification. All mechanical and thermal enabling components must have

CSA certification.

• All components (in particular the heatsink fins) must meet the test requirements

of UL1439 for sharp edges.

• If the International Accessibility Probe specified in IEC 950 can access the moving

parts of the fan, consider adding safety feature so that there is no risk of personal

injury.

4.5 Reference Attach Mechanism

4.5.1 Structural Design Strategy

Structural design strategy for the Intel reference thermal solution is to minimize

upward board deflection during shock.

The design uses a high clip stiffness that resists local board curvature under the

heatsink, and minimizes, in particular, upward board deflection.

4.5.2 Mechanical Interface to the Reference Attach Mechanism

The attach mechanism component (E21952-001) from the Intel Boxed Processor

thermal solution can be used by other 3rd party cooling solutions. The attach

mechanism consists of:

• A metal clip that interfaces with the heatsink, see Figure 22 for the component

drawings.

• Heatsink/fan mass ≤ 62 g

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Contents

Main Intel Celeron Processor 200 Sequence Page Contents Figures Tables Revision History 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management 1.1.2 Document Goals 1.1.3 Document Scope 1.2 Reference Documents .com/design/processo r/datashts/318546.ht m http://www.formfacto rs.org/ 1.3 Definition of Terms 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package Table 1. Micro-FCBGA Package Mechanical Specifications Page Page Page 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines 2.1.2.2 Heatsink Clip Load Requirement 2.1.2.3 Heatsink Attach Mechanism Design Considerations 2.2 Thermal Requirements 2.2.1 Processor Junction Temperature 2.3 Heatsink Design Considerations 2.3.1 Heatsink Size 2.3.2 Heatsink Mass 2.3.3 Thermal Interface Material 2.4 System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities Equation 1 TS-SYSTEM = TA + (TS-TOP TA) 16/PCPU TS-TOP-MAX = 91C 2.4.2 Improving Chassis Thermal Performance Page Page 2.4.3 Summary Page 3 Thermal Metrology 3.1 Characterizing Cooling Performance Requirements Equation 2 JA = (TJ TA) / PD Equation 3 JA = JS + HS_BASE + S-TOP-A Equation 4 (JA JS HS_BASE) PD + TA = TS-TOP-MAX 3.1.1 Example JA = (TJ TA) / TDP = (90 55) / 20 = 1.75 C/W SA = JA JS = 1.75 0.50 = 1.25 C/W TS-TOP-MAX = (jA jS HS_BASE) PD + TA = (1.25 0.30) 20 + 55 = 74 C 3.2 Local Ambient Temperature Measurement Guidelines Page 3.3 Processor Power Measurement Metrology Recommendation 3.3.1 Sample Preparation Equation 5 PD = VCC (Vi / RSENSE) Page Page Page 4 System Thermal/Mechanical Design Information 4.1 Overview of the Reference Design 4.1.1 Altitude 4.1.2 Heatsink Thermal Validation 4.2 Environmental Reliability Testing 4.2.1 Structural Reliability Testing 4.2.1.1 Random Vibration Test Procedure 3.13GRMS (10 minutes per axis) 4.2.1.2 Shock Test Procedure 4.2.1.2.1 Recommended Test Sequence 4.2.1.2.2 Post-Test Pass Criteria 4.2.2 Power Cycling 4.2.3 Recommended BIOS/CPU/Memory Test Procedures 4.3 Material and Recycling Requirements 4.4 Safety Requirements 4.5 Reference Attach Mechanism 4.5.1 Structural Design Strategy 4.5.2 Mechanical Interface to the Reference Attach Mechanism Page Appendix A Heatsink Clip Load Metrology A.1 Overview A.2 Test Preparation A.2.1 Heatsink Preparation A.2.2 Typical Test Equipment Table 5. Typical Test Equipment A.3 Test Procedure Examples Page Appendix B Intel Enabled Boxed Processor Thermal Solution Information Page Appendix C Mechanical Drawings