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Intel 200 Appendix B Intel Enabled Boxed Processor Thermal Solution Information

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Intel® Enabled Boxed Processor Thermal Solution Information

Thermal and Mechanical Design Guidelines 47

Appendix B Intel® Enabled Boxed Processor Thermal Solution Information

This appendix includes supplier information for Intel enabled vendors.

Table 6 lists suppliers that produce Intel® Boxed Processor thermal solution E21953-

001 components. The part numbers listed below identifies these reference

components. End-users are responsible for the verification of the Intel enabled

component offerings with the supplier. OEMs and System Integrators are responsible

for thermal, mechanical, and environmental validation of these solutions.

Table 6. Intel® Boxed Processor Thermal Solution Providers

4

. S

upplier

5

. Part

Description

6

. Par

t Number

7

. Con

tact

3

8. Phone

9

. Email

43. Moni

ca

Chih

44. +886-2-

2995-2666

ext. 1131

45. monic

a_chih

@ccic.

com.t

w

40. C

C

I

41. CPU

Heats

ink

Asse

mbly

42. E21

953-

001

46. Cind

y

Zha

ng

47. +886-2-

2995-2666

ext. 1140

48. cindy_

zhang

@ccic.

com.t

w

These vendors and devices are listed by Intel as a convenience to Intel's general

customer base, but Intel does not make any representations or warranties whatsoever

regarding quality, reliability, functionality, or compatibility of these devices. This list

and/or these devices may be subject to change without notice.

§

Contents

Main Intel Celeron Processor 200 Sequence Page Contents Figures Tables Revision History 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management 1.1.2 Document Goals 1.1.3 Document Scope 1.2 Reference Documents .com/design/processo r/datashts/318546.ht m http://www.formfacto rs.org/ 1.3 Definition of Terms 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package Table 1. Micro-FCBGA Package Mechanical Specifications Page Page Page 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines 2.1.2.2 Heatsink Clip Load Requirement 2.1.2.3 Heatsink Attach Mechanism Design Considerations 2.2 Thermal Requirements 2.2.1 Processor Junction Temperature 2.3 Heatsink Design Considerations 2.3.1 Heatsink Size 2.3.2 Heatsink Mass 2.3.3 Thermal Interface Material 2.4 System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities Equation 1 TS-SYSTEM = TA + (TS-TOP TA) 16/PCPU TS-TOP-MAX = 91C 2.4.2 Improving Chassis Thermal Performance Page Page 2.4.3 Summary Page 3 Thermal Metrology 3.1 Characterizing Cooling Performance Requirements Equation 2 JA = (TJ TA) / PD Equation 3 JA = JS + HS_BASE + S-TOP-A Equation 4 (JA JS HS_BASE) PD + TA = TS-TOP-MAX 3.1.1 Example JA = (TJ TA) / TDP = (90 55) / 20 = 1.75 C/W SA = JA JS = 1.75 0.50 = 1.25 C/W TS-TOP-MAX = (jA jS HS_BASE) PD + TA = (1.25 0.30) 20 + 55 = 74 C 3.2 Local Ambient Temperature Measurement Guidelines Page 3.3 Processor Power Measurement Metrology Recommendation 3.3.1 Sample Preparation Equation 5 PD = VCC (Vi / RSENSE) Page Page Page 4 System Thermal/Mechanical Design Information 4.1 Overview of the Reference Design 4.1.1 Altitude 4.1.2 Heatsink Thermal Validation 4.2 Environmental Reliability Testing 4.2.1 Structural Reliability Testing 4.2.1.1 Random Vibration Test Procedure 3.13GRMS (10 minutes per axis) 4.2.1.2 Shock Test Procedure 4.2.1.2.1 Recommended Test Sequence 4.2.1.2.2 Post-Test Pass Criteria 4.2.2 Power Cycling 4.2.3 Recommended BIOS/CPU/Memory Test Procedures 4.3 Material and Recycling Requirements 4.4 Safety Requirements 4.5 Reference Attach Mechanism 4.5.1 Structural Design Strategy 4.5.2 Mechanical Interface to the Reference Attach Mechanism Page Appendix A Heatsink Clip Load Metrology A.1 Overview A.2 Test Preparation A.2.1 Heatsink Preparation A.2.2 Typical Test Equipment Table 5. Typical Test Equipment A.3 Test Procedure Examples Page Appendix B Intel Enabled Boxed Processor Thermal Solution Information Page Appendix C Mechanical Drawings