Intel 200 3.3.1 Sample Preparation

Thermal Metrology

Thermal and Mechanical Design Guidelines 33

3.3.1 Sample Preparation

In order to accurately measure the processor power consumption, it is required to

attach sense resistor and replace one of the motherboard resistors. Schematic

diagram in Figure 13 illustrates the precision resistor (RSENSE) attached in series with

processor circuitry. The processor power consumption can be estimated by

Equation 5.

Equation 5 PD = VCC × (Vi / RSENSE)

Where:

PD = Processor total power dissipation (W) (assumes all power dissipates

through the processor die)

VCC = Processor core voltage.

Vi = Voltage measured across precision sense resistor.

RSENSE = Given resistance value of precision resistor.

The Isotek 4 terminal (Kelvin) precision resistor (with resistance of 1 mΩ and

Tol=0.1%) is recommended to be used for processor power measurement. Locate the

inductor L1VR inductor (near processor) on motherboard and attach the Isotek

precision resistor in-series with inductor as illustrated in Figure 13 schematic and

Figure 14 board layout schematic diagram. Additionally, it is required to replace

R27VR chip resistor (near processor) with a 19.6 KΩ rated chip resistor as illustrated

in Figure 15. The Walsin chip resistor (WR06X1962FTL) is one of the recommended

chip resistors for the rework.

Table 4. Test Accessories

5. Description Q

uantity 7. Part Number N

otes

9. Isotek 4 terminal

(Kelvin) precision

resistor

10. 1 11. P/N A-N-R001-F1-K2-0.1.

R=1 mΩ, Tol=0.1%, P=2W,

TCR<10 ppm/°C

12.

1

13. Walsin chip

resistor

14. 1 15. WR06X1962FTL. R= 19.6 KΩ,

Tol =1%, P=0.1W, TCR<200

ppm/°C.

16.

2

NOTE:

1. http://www.isotekcorp.com/productDisplay.asp?CatID=1&SubCatID

2. http://www.passivecomponent.com/lh3/search.asp

Contents

Main Intel Celeron Processor 200 Sequence Page Contents Figures Tables Revision History 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management 1.1.2 Document Goals 1.1.3 Document Scope 1.2 Reference Documents .com/design/processo r/datashts/318546.ht m http://www.formfacto rs.org/ 1.3 Definition of Terms 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package Table 1. Micro-FCBGA Package Mechanical Specifications Page Page Page 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines 2.1.2.2 Heatsink Clip Load Requirement 2.1.2.3 Heatsink Attach Mechanism Design Considerations 2.2 Thermal Requirements 2.2.1 Processor Junction Temperature 2.3 Heatsink Design Considerations 2.3.1 Heatsink Size 2.3.2 Heatsink Mass 2.3.3 Thermal Interface Material 2.4 System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities Equation 1 TS-SYSTEM = TA + (TS-TOP TA) 16/PCPU TS-TOP-MAX = 91C 2.4.2 Improving Chassis Thermal Performance Page Page 2.4.3 Summary Page 3 Thermal Metrology 3.1 Characterizing Cooling Performance Requirements Equation 2 JA = (TJ TA) / PD Equation 3 JA = JS + HS_BASE + S-TOP-A Equation 4 (JA JS HS_BASE) PD + TA = TS-TOP-MAX 3.1.1 Example JA = (TJ TA) / TDP = (90 55) / 20 = 1.75 C/W SA = JA JS = 1.75 0.50 = 1.25 C/W TS-TOP-MAX = (jA jS HS_BASE) PD + TA = (1.25 0.30) 20 + 55 = 74 C 3.2 Local Ambient Temperature Measurement Guidelines Page 3.3 Processor Power Measurement Metrology Recommendation 3.3.1 Sample Preparation Equation 5 PD = VCC (Vi / RSENSE) Page Page Page 4 System Thermal/Mechanical Design Information 4.1 Overview of the Reference Design 4.1.1 Altitude 4.1.2 Heatsink Thermal Validation 4.2 Environmental Reliability Testing 4.2.1 Structural Reliability Testing 4.2.1.1 Random Vibration Test Procedure 3.13GRMS (10 minutes per axis) 4.2.1.2 Shock Test Procedure 4.2.1.2.1 Recommended Test Sequence 4.2.1.2.2 Post-Test Pass Criteria 4.2.2 Power Cycling 4.2.3 Recommended BIOS/CPU/Memory Test Procedures 4.3 Material and Recycling Requirements 4.4 Safety Requirements 4.5 Reference Attach Mechanism 4.5.1 Structural Design Strategy 4.5.2 Mechanical Interface to the Reference Attach Mechanism Page Appendix A Heatsink Clip Load Metrology A.1 Overview A.2 Test Preparation A.2.1 Heatsink Preparation A.2.2 Typical Test Equipment Table 5. Typical Test Equipment A.3 Test Procedure Examples Page Appendix B Intel Enabled Boxed Processor Thermal Solution Information Page Appendix C Mechanical Drawings