Intel 200 1.2 Reference Documents , 1.3 Definition of Terms

Introduction

Thermal and Mechanical Design Guidelines 9

1.2 Reference Documents

Material and concepts available in the following documents may be beneficial when

reading this document.

Document Document

No./Location

Intel® Celeron® Processor 200 Sequence Datasheet http://developer.intel

.com/design/processo

r/datashts/318546.ht

m

Power Supply Design Guide for Desktop Platform Form Factors (Rev

1.1)

http://www.formfacto

rs.org/

ATX Thermal Design Suggestions http://www.formfactors.

org/

microATX Thermal Design Suggestions http://www.formfactors.

org/

Balanced Technology Extended (BTX) System Design Guide http://www.formfactors.

org/

Thermally Advantaged Chassis version 1.1 http://www.intel.com/g

o/chassis/

1.3 Definition of Terms

Term Description

TA

The measured ambient temperature locally surrounding the processor. The

ambient temperature should be measured just upstream of a passive heatsink or

at the fan inlet for an active heatsink.

TJ Processor junction temperature.

TS-TOP Heatsink temperature measured at vicinity to center on the top surface of

heatsink base.

ΨJA

Junction-to-ambient thermal characterization parameter (psi). A measure of

thermal solution performance using total package power. Defined as

(TJ – TA) / Total Package Power.

Note: Heat source must be specified for Ψ measurements.

ΨJS

Junction-to-sink thermal characterization parameter. A measure of thermal

interface material performance using total package power. Defined as

(TJ – TS) / Total Package Power.

Note: Heat source must be specified for Ψ measurements.

ΨSA Sink-to-ambient thermal characterization parameter. A measure of heatsink

thermal performance using total package power. Defined as

Contents

Main Intel Celeron Processor 200 Sequence Page Contents Figures Tables Revision History 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management 1.1.2 Document Goals 1.1.3 Document Scope 1.2 Reference Documents .com/design/processo r/datashts/318546.ht m http://www.formfacto rs.org/ 1.3 Definition of Terms 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package Table 1. Micro-FCBGA Package Mechanical Specifications Page Page Page 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines 2.1.2.2 Heatsink Clip Load Requirement 2.1.2.3 Heatsink Attach Mechanism Design Considerations 2.2 Thermal Requirements 2.2.1 Processor Junction Temperature 2.3 Heatsink Design Considerations 2.3.1 Heatsink Size 2.3.2 Heatsink Mass 2.3.3 Thermal Interface Material 2.4 System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities Equation 1 TS-SYSTEM = TA + (TS-TOP TA) 16/PCPU TS-TOP-MAX = 91C 2.4.2 Improving Chassis Thermal Performance Page Page 2.4.3 Summary Page 3 Thermal Metrology 3.1 Characterizing Cooling Performance Requirements Equation 2 JA = (TJ TA) / PD Equation 3 JA = JS + HS_BASE + S-TOP-A Equation 4 (JA JS HS_BASE) PD + TA = TS-TOP-MAX 3.1.1 Example JA = (TJ TA) / TDP = (90 55) / 20 = 1.75 C/W SA = JA JS = 1.75 0.50 = 1.25 C/W TS-TOP-MAX = (jA jS HS_BASE) PD + TA = (1.25 0.30) 20 + 55 = 74 C 3.2 Local Ambient Temperature Measurement Guidelines Page 3.3 Processor Power Measurement Metrology Recommendation 3.3.1 Sample Preparation Equation 5 PD = VCC (Vi / RSENSE) Page Page Page 4 System Thermal/Mechanical Design Information 4.1 Overview of the Reference Design 4.1.1 Altitude 4.1.2 Heatsink Thermal Validation 4.2 Environmental Reliability Testing 4.2.1 Structural Reliability Testing 4.2.1.1 Random Vibration Test Procedure 3.13GRMS (10 minutes per axis) 4.2.1.2 Shock Test Procedure 4.2.1.2.1 Recommended Test Sequence 4.2.1.2.2 Post-Test Pass Criteria 4.2.2 Power Cycling 4.2.3 Recommended BIOS/CPU/Memory Test Procedures 4.3 Material and Recycling Requirements 4.4 Safety Requirements 4.5 Reference Attach Mechanism 4.5.1 Structural Design Strategy 4.5.2 Mechanical Interface to the Reference Attach Mechanism Page Appendix A Heatsink Clip Load Metrology A.1 Overview A.2 Test Preparation A.2.1 Heatsink Preparation A.2.2 Typical Test Equipment Table 5. Typical Test Equipment A.3 Test Procedure Examples Page Appendix B Intel Enabled Boxed Processor Thermal Solution Information Page Appendix C Mechanical Drawings