Intel 200 - page 50

Mechanical Drawings

50 Thermal and Mechanical Design Guidelines

Figure 21. Motherboard Keep-out Footprint Definition and Height Restrictions for

Enabling Components

Contents

Main Intel Celeron Processor 200 Sequence Page Contents Figures Tables Revision History 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management 1.1.2 Document Goals 1.1.3 Document Scope 1.2 Reference Documents .com/design/processo r/datashts/318546.ht m http://www.formfacto rs.org/ 1.3 Definition of Terms 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package Table 1. Micro-FCBGA Package Mechanical Specifications Page Page Page 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines 2.1.2.2 Heatsink Clip Load Requirement 2.1.2.3 Heatsink Attach Mechanism Design Considerations 2.2 Thermal Requirements 2.2.1 Processor Junction Temperature 2.3 Heatsink Design Considerations 2.3.1 Heatsink Size 2.3.2 Heatsink Mass 2.3.3 Thermal Interface Material 2.4 System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities Equation 1 TS-SYSTEM = TA + (TS-TOP TA) 16/PCPU TS-TOP-MAX = 91C 2.4.2 Improving Chassis Thermal Performance Page Page 2.4.3 Summary Page 3 Thermal Metrology 3.1 Characterizing Cooling Performance Requirements Equation 2 JA = (TJ TA) / PD Equation 3 JA = JS + HS_BASE + S-TOP-A Equation 4 (JA JS HS_BASE) PD + TA = TS-TOP-MAX 3.1.1 Example JA = (TJ TA) / TDP = (90 55) / 20 = 1.75 C/W SA = JA JS = 1.75 0.50 = 1.25 C/W TS-TOP-MAX = (jA jS HS_BASE) PD + TA = (1.25 0.30) 20 + 55 = 74 C 3.2 Local Ambient Temperature Measurement Guidelines Page 3.3 Processor Power Measurement Metrology Recommendation 3.3.1 Sample Preparation Equation 5 PD = VCC (Vi / RSENSE) Page Page Page 4 System Thermal/Mechanical Design Information 4.1 Overview of the Reference Design 4.1.1 Altitude 4.1.2 Heatsink Thermal Validation 4.2 Environmental Reliability Testing 4.2.1 Structural Reliability Testing 4.2.1.1 Random Vibration Test Procedure 3.13GRMS (10 minutes per axis) 4.2.1.2 Shock Test Procedure 4.2.1.2.1 Recommended Test Sequence 4.2.1.2.2 Post-Test Pass Criteria 4.2.2 Power Cycling 4.2.3 Recommended BIOS/CPU/Memory Test Procedures 4.3 Material and Recycling Requirements 4.4 Safety Requirements 4.5 Reference Attach Mechanism 4.5.1 Structural Design Strategy 4.5.2 Mechanical Interface to the Reference Attach Mechanism Page Appendix A Heatsink Clip Load Metrology A.1 Overview A.2 Test Preparation A.2.1 Heatsink Preparation A.2.2 Typical Test Equipment Table 5. Typical Test Equipment A.3 Test Procedure Examples Page Appendix B Intel Enabled Boxed Processor Thermal Solution Information Page Appendix C Mechanical Drawings