PCI/ISA Expansion

Bank 0(J2D1, J2D2)

 

Simm

 

 

Connector(J6J2)

 

Socket(6)

 

Bank 1(J2E1, J2F1)

 

 

 

 

 

 

 

 

 

1

Bank 2(J2E1, J2F1)

 

 

 

 

CDROM

 

 

 

 

 

 

J6N1

 

J9N2

 

 

 

 

4

 

Modem/Audio

 

 

 

 

 

 

 

 

 

1

2

 

Connector

 

1

J9N1

 

1

 

5

 

 

 

 

 

 

 

 

 

 

2

 

 

 

 

 

 

Floppy

 

 

 

 

 

 

Drive

 

 

 

 

7

8

J9K1

 

 

J9K2

 

 

 

 

Wave

 

 

 

 

 

 

 

1

3

 

Table

33

34

PS Remote

 

 

 

 

 

Connector

 

 

 

ATI Media

 

 

34

33

 

 

1

 

 

 

Connector

 

 

 

 

 

3.3V

 

 

 

(J1H1)

 

 

 

 

 

Power

 

MIDI

 

 

 

 

J9H1

 

Audio

 

CELP

 

6

 

 

 

Connector

 

 

2

1

 

(J1D1)

 

1

 

 

 

J9L1

 

 

 

 

 

 

 

 

 

 

Primary

 

 

 

 

1

2

Power

 

 

 

 

J9H1

 

 

 

 

 

 

 

 

 

 

 

PCI IDE

 

 

 

 

 

 

Connector(2)

 

 

 

 

 

 

J5C1

12

 

 

 

 

 

J6C1

 

 

 

 

 

39

40

J3A1

 

 

 

 

 

 

 

 

 

 

29

 

1

 

 

 

Front Panel I/O Connector

OM04275

Figure 3. Advanced/RH connector locations

Advanced/RH Technical Product Specification Page 15

Page 15
Image 15
Intel 281809-003 manual Cdrom, Midi, Pci Ide

281809-003 specifications

The Intel 281809-003 is a notable memory module developed by Intel, showcasing advanced features and technologies that cater to a variety of computing applications. As part of Intel's extensive range of semiconductor products, the 281809-003 exemplifies the company’s commitment to enhancing data storage and retrieval processes.

One of the key features of the Intel 281809-003 is its capacity, designed to support a significant amount of data for efficient computing tasks. The module delivers robust performance, with increased speed and reliability that meet the demands of modern computing environments. This memory module provides enhanced data transfer rates that facilitate quick access to frequently utilized data, reducing latency and improving overall system responsiveness.

The Intel 281809-003 utilizes dynamic random access memory (DRAM) technology, which is fundamental to its operation. DRAM is known for its ability to hold data temporarily while the device is powered on, making it ideal for applications that require rapid data processing, such as gaming, content creation, and complex simulations. The efficiency of the DRAM technology also plays a pivotal role in optimizing energy consumption, thus contributing to better performance-to-power ratios.

In terms of architecture, the Intel 281809-003 is built to integrate seamlessly with Intel platforms, ensuring compatibility and optimized performance with Intel's processors. The module employs advanced error-correcting code (ECC) technology, which helps detect and correct common types of data corruption, enhancing data integrity and system stability. This feature is particularly important for mission-critical applications where data consistency is crucial.

The Intel 281809-003 also offers scalability options, making it a suitable choice for a range of systems from entry-level desktops to high-performance servers. This versatility allows for easy upgrades, accommodating evolving user needs and technological advancements without requiring complete system overhauls.

Another significant characteristic of the Intel 281809-003 is its adherence to industry standards, including JEDEC specifications, which ensures that the module is reliable and widely supported across various hardware configurations. Additionally, its design includes considerations for heat dissipation, enhancing longevity and performance during extended use.

In summary, the Intel 281809-003 memory module stands out due to its impressive capacity, speed, ECC technology, and compatibility with Intel's ecosystems. By integrating advanced DRAM technologies and adhering to rigorous industry standards, the Intel 281809-003 represents a key component for users seeking reliable and efficient memory solutions in their computing endeavors.