Appendix L Environmental Standards

MOTHERBOARD SPECIFICATIONS

Parameter

Condition

 

 

Specification

 

Temperature

 

 

-40oC to +70oC

 

 

 

Non-Operating

 

 

 

 

Operating

 

+0oC to +55oC

(minimum air flow of 200 LFM)

 

DC Voltage

 

 

 

 

 

 

+5 V

±5 %

 

 

 

-5 V

±5 %

 

 

 

+12 V

±5 %

 

 

 

-12 V

±5 %

 

 

Vibration

 

 

 

 

 

 

Unpackaged

 

5 Hz to 20 Hz : 0.01g² Hz sloping up to 0.02 g² Hz

 

 

 

 

20 Hz to 500 Hz : 0.02g² Hz (flat)

 

 

Packaged

 

10 Hz to 40 Hz : 0.015g² Hz (flat)

 

 

 

 

 

 

 

40 Hz to 500 Hz : 0.015g² Hz sloping down to 0.00015 g² Hz

Shock

 

 

 

 

 

 

Unpackaged

 

50 G trapezoidal waveform

 

 

 

 

Velocity change of 170 inches/sec.

 

 

Packaged

 

Half Sine 2 millisecond

 

 

 

 

 

 

 

Product

Free Fall

Velocity

 

 

 

(Weight)

(Height in inches)

(Change (in / sec))

 

 

 

< 20 lb.

36

167

 

 

21 - 40

30

152

 

 

41 - 80

24

136

 

 

81 - 100

18

118

 

 

Table L-1. Environmental standards

 

Advanced/RH Technical Product Specification

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Intel 281809-003 manual Appendix L − Environmental Standards, Motherboard Specifications, Parameter Condition Specification

281809-003 specifications

The Intel 281809-003 is a notable memory module developed by Intel, showcasing advanced features and technologies that cater to a variety of computing applications. As part of Intel's extensive range of semiconductor products, the 281809-003 exemplifies the company’s commitment to enhancing data storage and retrieval processes.

One of the key features of the Intel 281809-003 is its capacity, designed to support a significant amount of data for efficient computing tasks. The module delivers robust performance, with increased speed and reliability that meet the demands of modern computing environments. This memory module provides enhanced data transfer rates that facilitate quick access to frequently utilized data, reducing latency and improving overall system responsiveness.

The Intel 281809-003 utilizes dynamic random access memory (DRAM) technology, which is fundamental to its operation. DRAM is known for its ability to hold data temporarily while the device is powered on, making it ideal for applications that require rapid data processing, such as gaming, content creation, and complex simulations. The efficiency of the DRAM technology also plays a pivotal role in optimizing energy consumption, thus contributing to better performance-to-power ratios.

In terms of architecture, the Intel 281809-003 is built to integrate seamlessly with Intel platforms, ensuring compatibility and optimized performance with Intel's processors. The module employs advanced error-correcting code (ECC) technology, which helps detect and correct common types of data corruption, enhancing data integrity and system stability. This feature is particularly important for mission-critical applications where data consistency is crucial.

The Intel 281809-003 also offers scalability options, making it a suitable choice for a range of systems from entry-level desktops to high-performance servers. This versatility allows for easy upgrades, accommodating evolving user needs and technological advancements without requiring complete system overhauls.

Another significant characteristic of the Intel 281809-003 is its adherence to industry standards, including JEDEC specifications, which ensures that the module is reliable and widely supported across various hardware configurations. Additionally, its design includes considerations for heat dissipation, enhancing longevity and performance during extended use.

In summary, the Intel 281809-003 memory module stands out due to its impressive capacity, speed, ECC technology, and compatibility with Intel's ecosystems. By integrating advanced DRAM technologies and adhering to rigorous industry standards, the Intel 281809-003 represents a key component for users seeking reliable and efficient memory solutions in their computing endeavors.