PROCESSOR UPGRADE
The Advanced/RH motherboard is manufactured with the
SECOND LEVEL CACHE
The Intel 82430HX PCIset supports a second level cache that uses high performance Synchronous Pipeline Burst SRAM. Asynchronous cache is not supported by the 82430HX controller. Pipeline Burst (PB) SRAM provides performance similar to expensive Synchronous Burst SRAMs for only a slight cost premium over slower performing asynchronous SRAMs.
As a manufacturing option, the Advanced/RH motherboard without onboard cache can be provided with a Card Edge Low Profile (CELP) version 2.1 socket that provides flexibility for second level cache options. The CELP socket can accommodate either a 256 KB or 512 KB cache module and is designed to work with modules that adhere to the COAST (Cache On A Stick) specification, version 2.1. The cache size is automatically detected and configured by the system BIOS for optimal performance. For a list of cache module suppliers or a copy of the COAST specification, contact your local Intel sales office or Intel authorized distributor.
SYSTEM MEMORY
The Advanced/RH motherboard provides six
The six sockets are arranged as Bank 0, Bank 1, and Bank 2. Each bank consists of two sockets and provides a
When banks 1 and 2 are populated at the same time, memory timing is modified from x333 to x444. This is due to loading on the address line shared by these two banks. In most applications the L2 cache will mask any performance degradation that is incurred. In addition, when using EDO Parity memory in an ECC configuration memory timing is changed from x222 to x333 to allow the chipset to perform Read Modify Writes.
EDO DRAM
Extended Data Out, or Hyper Page, DRAM is designed to improve the DRAM read performance. EDO DRAM holds the memory data valid until the next CAS# falling edge, unlike standard fast page mode DRAM which
Advanced/RH Technical Product Specification ∙ Page 9