Appendix C Memory Map

Address Range

1024K-512M

960K-1023K

944K-959K

936K-943K

928K-935K

896K-927K

800-895K

640K-799K

639K

512K-638K

0K-511K

Address Range

100000-20000000

F0000-FFFFF EC000-EFFFF EA000-EBFFF E8000-E9FFF E0000-E7FFF C8000-DFFFF A0000-C7FFF 9FC00-9FFFF 80000-9FBFF 00000-7FFFF

Size

511M

64K

16K

8K

8K

32K

96K

160K

1K

127K

512K

Description

Extended Memory

AMI System run time BIOS

Main BIOS Recovery Code

ESCD (Plug ‘N’ Play configuration area) OEM LOGO (available as UMB)

BIOS RESERVED (Currently available as UMB) Available HI DOS memory (open to ISA and PCI bus) Off-board video memory and BIOS

Extended BIOS Data (moveable by QEMM, 386MAX) Extended conventional

Conventional

Table C-1. Advanced/RH Memory Map

The table above details the Advanced/RH memory map. The ESCD area from EA000-EBFFF is not available for use as an Upper Memory Block (UMB) by memory managers. The area from E0000-E7FFF is currently not used by the BIOS and is available for use as UMB by memory managers. Parts of this area may be used by future versions of the BIOS to add increased functionality.

Advanced/RH Technical Product Specification Page 28

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Intel 281809-003 manual Appendix C − Memory Map, Address Range, Size, Description

281809-003 specifications

The Intel 281809-003 is a notable memory module developed by Intel, showcasing advanced features and technologies that cater to a variety of computing applications. As part of Intel's extensive range of semiconductor products, the 281809-003 exemplifies the company’s commitment to enhancing data storage and retrieval processes.

One of the key features of the Intel 281809-003 is its capacity, designed to support a significant amount of data for efficient computing tasks. The module delivers robust performance, with increased speed and reliability that meet the demands of modern computing environments. This memory module provides enhanced data transfer rates that facilitate quick access to frequently utilized data, reducing latency and improving overall system responsiveness.

The Intel 281809-003 utilizes dynamic random access memory (DRAM) technology, which is fundamental to its operation. DRAM is known for its ability to hold data temporarily while the device is powered on, making it ideal for applications that require rapid data processing, such as gaming, content creation, and complex simulations. The efficiency of the DRAM technology also plays a pivotal role in optimizing energy consumption, thus contributing to better performance-to-power ratios.

In terms of architecture, the Intel 281809-003 is built to integrate seamlessly with Intel platforms, ensuring compatibility and optimized performance with Intel's processors. The module employs advanced error-correcting code (ECC) technology, which helps detect and correct common types of data corruption, enhancing data integrity and system stability. This feature is particularly important for mission-critical applications where data consistency is crucial.

The Intel 281809-003 also offers scalability options, making it a suitable choice for a range of systems from entry-level desktops to high-performance servers. This versatility allows for easy upgrades, accommodating evolving user needs and technological advancements without requiring complete system overhauls.

Another significant characteristic of the Intel 281809-003 is its adherence to industry standards, including JEDEC specifications, which ensures that the module is reliable and widely supported across various hardware configurations. Additionally, its design includes considerations for heat dissipation, enhancing longevity and performance during extended use.

In summary, the Intel 281809-003 memory module stands out due to its impressive capacity, speed, ECC technology, and compatibility with Intel's ecosystems. By integrating advanced DRAM technologies and adhering to rigorous industry standards, the Intel 281809-003 represents a key component for users seeking reliable and efficient memory solutions in their computing endeavors.