BACK PANEL I/O

PS/2 KEYBOARD J8N1 & MOUSE

PORTS J7N1

Pin Signal Name

1Data

2No Connect

3Ground

4Vcc

5Clock

SERIAL PORTS COM1 J6N2 & COM2

J5N1

PARALLEL PORT J3N1

Pin

Signal Name

 

 

1DCD

2Serial In - (SIN)

3Serial Out - (SOUT)

4DTR-

5GND

6DSR-

7RTS-

8CTS-

9RI

USB J5N2 REPLACES COM2

Pin

Signal Name

1

VCC

2

USBP0-

Signal Name

STROBE-

Data Bit 0

Data Bit 1

Data Bit 2

Data Bit 3

Data Bit 4

Data Bit 5

Data Bit 6

Data Bit 7

ACK-

BUSY

PE (Paper End)

SLCT

Pin

1

2

3

4

5

6

7

8

9

10

11

12

13

Pin

14

15

16

17

18

19

20

21

22

23

24

25

26

Signal Name

AUTO FEED-

ERROR-

INIT-

SLCT IN-

Ground

Ground

Ground

Ground

Ground

Ground

Ground

Ground

N.C.

3

USBP0

4

GND

5

VCC

6

USBP1-

7

USBP1

8

GND

LINE OUT J9N2

Pin

Signal Name

1

Line Out

MIC IN J8N2

Pin

Signal Name

1

Line Out

VIDEO MONITOR PORT J1N1

Pin

Signal Name

1

Red

2

Green

3

Blue

4

No Connect

5

Ground

6

Ground

7

Ground

8

Ground

9

No Connect

10

Ground

11

No Connect

12

MONID1

13

Horizontal Sync.

14

Vertical Sync.

15

MONID2

Advanced/RH Technical Product Specification Page 34

Page 34
Image 34
Intel 281809-003 manual Back Panel I/O

281809-003 specifications

The Intel 281809-003 is a notable memory module developed by Intel, showcasing advanced features and technologies that cater to a variety of computing applications. As part of Intel's extensive range of semiconductor products, the 281809-003 exemplifies the company’s commitment to enhancing data storage and retrieval processes.

One of the key features of the Intel 281809-003 is its capacity, designed to support a significant amount of data for efficient computing tasks. The module delivers robust performance, with increased speed and reliability that meet the demands of modern computing environments. This memory module provides enhanced data transfer rates that facilitate quick access to frequently utilized data, reducing latency and improving overall system responsiveness.

The Intel 281809-003 utilizes dynamic random access memory (DRAM) technology, which is fundamental to its operation. DRAM is known for its ability to hold data temporarily while the device is powered on, making it ideal for applications that require rapid data processing, such as gaming, content creation, and complex simulations. The efficiency of the DRAM technology also plays a pivotal role in optimizing energy consumption, thus contributing to better performance-to-power ratios.

In terms of architecture, the Intel 281809-003 is built to integrate seamlessly with Intel platforms, ensuring compatibility and optimized performance with Intel's processors. The module employs advanced error-correcting code (ECC) technology, which helps detect and correct common types of data corruption, enhancing data integrity and system stability. This feature is particularly important for mission-critical applications where data consistency is crucial.

The Intel 281809-003 also offers scalability options, making it a suitable choice for a range of systems from entry-level desktops to high-performance servers. This versatility allows for easy upgrades, accommodating evolving user needs and technological advancements without requiring complete system overhauls.

Another significant characteristic of the Intel 281809-003 is its adherence to industry standards, including JEDEC specifications, which ensures that the module is reliable and widely supported across various hardware configurations. Additionally, its design includes considerations for heat dissipation, enhancing longevity and performance during extended use.

In summary, the Intel 281809-003 memory module stands out due to its impressive capacity, speed, ECC technology, and compatibility with Intel's ecosystems. By integrating advanced DRAM technologies and adhering to rigorous industry standards, the Intel 281809-003 represents a key component for users seeking reliable and efficient memory solutions in their computing endeavors.