LPX FORM FACTOR

The Advanced/RH motherboard is designed to fit into a standard LPX form factor chassis. Figure 2 illustrates the mechanical form factor for the Advanced/RH. The Advanced/RH LPX form factor does adhere to the standard LPX guidelines in that the outer dimensions are 13” x 9”. Location of the I/O connectors, riser slot, and mounting holes are in strict compliance with the LPX specification. However, if business audio is selected by an OEM, a slight modification to the OEM’s chassis may be necessary to accept the audio jacks on the motherboard.

13.0

11.375

5.875

0.375

 

0.219

0.0

 

 

0.0

 

9.0

0.35

3.906

7.500

 

 

8.8125

 

 

OM04271

Figure 2. Advanced/RH Motherboard dimensions

CPU

The Advanced/RH LPX motherboard is designed to operate with 3.3 volt Pentium processors. The 3.3 volt power is provided by a patented on-board voltage regulator circuit. An on-board jumper enables use of VRE specified processors. The voltage regulator provides the required voltage for the processor from the 5 volt output of a standard power supply. Processors which run internally at 75, 90, 100, 120, 133, 150 and 166 MHz, and have iCOMP® ratings of 615, 735, 815, 1000, 1110, 1176 and 1308 respectively are supported. Future Pentium processors will also be supported.

The Pentium processor maintains full backward compatibility with the 8086, 80286, Intel386and Intel486processors. It supports both read and write burst mode bus cycles, and includes separate 8 KB on-chip code and data write-back caches. Also integrated into the Pentium processor is an advanced numeric coprocessor which significantly increases the speed of floating point operations, while maintaining backward compatibility with the Intel486DXmath coprocessor and complying to ANSI/IEEE standard 754-1985.

Advanced/RH Technical Product Specification Page 8

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Intel 281809-003 manual LPX Form Factor, Cpu

281809-003 specifications

The Intel 281809-003 is a notable memory module developed by Intel, showcasing advanced features and technologies that cater to a variety of computing applications. As part of Intel's extensive range of semiconductor products, the 281809-003 exemplifies the company’s commitment to enhancing data storage and retrieval processes.

One of the key features of the Intel 281809-003 is its capacity, designed to support a significant amount of data for efficient computing tasks. The module delivers robust performance, with increased speed and reliability that meet the demands of modern computing environments. This memory module provides enhanced data transfer rates that facilitate quick access to frequently utilized data, reducing latency and improving overall system responsiveness.

The Intel 281809-003 utilizes dynamic random access memory (DRAM) technology, which is fundamental to its operation. DRAM is known for its ability to hold data temporarily while the device is powered on, making it ideal for applications that require rapid data processing, such as gaming, content creation, and complex simulations. The efficiency of the DRAM technology also plays a pivotal role in optimizing energy consumption, thus contributing to better performance-to-power ratios.

In terms of architecture, the Intel 281809-003 is built to integrate seamlessly with Intel platforms, ensuring compatibility and optimized performance with Intel's processors. The module employs advanced error-correcting code (ECC) technology, which helps detect and correct common types of data corruption, enhancing data integrity and system stability. This feature is particularly important for mission-critical applications where data consistency is crucial.

The Intel 281809-003 also offers scalability options, making it a suitable choice for a range of systems from entry-level desktops to high-performance servers. This versatility allows for easy upgrades, accommodating evolving user needs and technological advancements without requiring complete system overhauls.

Another significant characteristic of the Intel 281809-003 is its adherence to industry standards, including JEDEC specifications, which ensures that the module is reliable and widely supported across various hardware configurations. Additionally, its design includes considerations for heat dissipation, enhancing longevity and performance during extended use.

In summary, the Intel 281809-003 memory module stands out due to its impressive capacity, speed, ECC technology, and compatibility with Intel's ecosystems. By integrating advanced DRAM technologies and adhering to rigorous industry standards, the Intel 281809-003 represents a key component for users seeking reliable and efficient memory solutions in their computing endeavors.