Intel 6700PXH Mechanical Design Envelope, Board-Level Components Keepout Dimensions, Motherboard

Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution

6.3Mechanical Design Envelope

R

While each design may have unique mechanical volume and height restrictions or implementation requirements, the height, width, and depth constraints typically placed on the PXH thermal solution are shown in Figure 6-2Figure 6-2Figure 6-2.

When using heatsinks that extend beyond the PXH reference heatsink envelope shown in Figure 6-2Figure 6-2Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot exceed 2.40 mm (0.094 in.) in height.

Figure 6-2. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6700PXH 64-bit PCI Hub Chipset Component

	Heatsink Fin	3.01mm.
		1.86mm. 14.71mm
	Heatsink Base
FCBGA +	Die + TIM
	Motherboard
Solder Balls
	31.00mm.
	Heatsink	31.00mm.
	Fin
	3.00mm.

6.4Board-Level Components Keepout Dimensions

The locations of hole pattern and keepout zones for the reference thermal solution are shown in Figure 6-3Figure 6-3Figure 6-3 and Figure 6-4Figure 6-4Figure 6-4.

6.5Torsional Clip Heatsink Thermal Solution Assembly

The reference thermal solution for the PXH component is a passive extruded heatsink with thermal interface. It is attached using a clip with each end hooked through an anchor soldered to the board. Figure 6-5Figure 6-5Figure 6-5 shows the reference thermal solution assembly and associated components. Figure 6-6Figure 6-6Figure 6-6 shows the position of the heatsink rails relative to the PXH package top surface.

Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix B. Appendix A contains vendor information for each thermal solution component.

18 Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines