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6 Reference Thermal Solution
Intel has developed one reference thermal solution to meet the cooling needs of the PXH component under operating environments and specifications defined in this document. This chapter describes the overall requirements for the reference thermal solution including
6.1Operating Environment
The PXH reference thermal solution was designed assuming a maximum
6.2Heatsink Performance
Figure
Figure
| 6.0 |
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| 5.5 |
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ca (°C/W) | 5.0 |
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4.5 |
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| 4.0 |
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| 3.5 |
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| 50 | 100 | 150 | 200 | 250 | 300 |
Flow Rate (LFM)
Intel® 6700PXH | 17 |