Intel 6700PXH manual Reliability Guidelines, Test Requirement Pass/Fail Criteria

Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution

Figure 6-7. Torsional Clip Heatsink Extrusion Profile

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6.5.6Clip Retention Anchors

For Intel® 6700PXH 64-bit PCI Hub-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board. It is based on a standard three-pin jumper and is soldered to the board like any common through-hole header. A new anchor design is available with 45° bent leads to increase the anchor attach reliability over time. See Appendix A for the part number and supplier information.

6.6Reliability Guidelines

Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Table 6-2Table 6-2Table 6-2.

Table 6-2. Reliability Guidelines

Test (1)	Requirement	Pass/Fail Criteria (2)
Mechanical Shock	50 g, board level, 11 msec, 3 shocks/axis.	Visual Check and Electrical
		Functional Test
Random Vibration	7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz.	Visual Check and Electrical
		Functional Test
Temperature Life	85°C, 2000 hours total, checkpoints at 168, 500,	Visual Check
	1000, and 2000 hours.
Thermal Cycling	–5°C to +70°C, 500 cycles.	Visual Check
Humidity	85% relative humidity, 55°C, 1000 hours.	Visual Check
NOTES:

1.It is recommended that the above tests be performed on a sample size of at least twelve assemblies from three lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

22 Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines