Introduction
Tcase_max
Tcase_min
TDP
R
Maximum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.
Minimum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.
Thermal design power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can dissipate.
1.2Reference Documents
The reader of this specification should also be familiar with material and concepts presented in the following documents:
•Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Datasheet
•Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide
•Intel®6700PXH
•Intel® 6700PXH
•Intel® 6700PXH
•Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide
•Intel® 6300ESB I/O Controller Hub Datasheet
•Intel® 6300ESB I/O Controller Hub (ICH) Specification Update
•BGA/OLGA Assembly Development Guide
•Various system thermal design suggestions (http://www.formfactors.org)
Note: Unless otherwise specified, these documents are available through your Intel field sales representative. Some documents may not be available at this time.
8 | Intel® 6700PXH |
