Manuals / Intel / Computer Equipment / Computer Hardware

Intel 6700PXH manual Reference Documents, Introduction

Models: 6700PXH

1 28

Download 28 pages 28.96 Kb

Page 8

Introduction

Tcase_max

Tcase_min

TDP

R

Maximum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.

Minimum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.

Thermal design power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can dissipate.

1.2Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the following documents:

•Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Datasheet

•Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide

•Intel®6700PXH 64-bit PCI Hub (PXH) Thermal/Mechanical Design Guide

•Intel® 6700PXH 64-bit PCI Hub (PXH) Datasheet

•Intel® 6700PXH 64-bit PCI Hub (PXH) Specification Update

•Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide

•Intel® 6300ESB I/O Controller Hub Datasheet

•Intel® 6300ESB I/O Controller Hub (ICH) Specification Update

•BGA/OLGA Assembly Development Guide

•Various system thermal design suggestions (http://www.formfactors.org)

Note: Unless otherwise specified, these documents are available through your Intel field sales representative. Some documents may not be available at this time.

8	Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

Image 8

Intel manual Reference Documents, Introduction, Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines

Contents

August Thermal/Mechanical Design GuidelinesIntel 6700PXH 64-bit PCI Hub Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines Contents Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design GuidelinesIntel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines FiguresTables Revision History Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design GuidelinesRevision DescriptionIntroduction Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design GuidelinesIntel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines 1 Introduction1.1 Definition of Terms Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines 1.2 Reference DocumentsIntroduction Figure 2-1. Intel 6700PXH 64-bit PCI Hub Package Dimensions Top View Figure 2-2. Intel 6700PXH 64-bit PCI Hub Package Dimensions Side View2 Packaging Technology Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines2.1 Package Mechanical Requirements Packaging TechnologyPackaging TechnologyPackaging Technology1. All dimensions are in millimeters 2. All dimensions and tolerances conform to ANSI Y14.5M-19943 Thermal Specifications 3.1 Thermal Design Power TDP3.2 Die Case Temperature Specifications Table 3-1. Intel 6700PXH 64-bit PCI Hub Thermal SpecificationsThermal SpecificationsThermal Simulation Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines4 Thermal Simulation Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design GuidelinesThermal SimulationThermal Simulation Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines5.1 Die Case Temperature Measurements 5 Thermal Metrology5.1.1 Zero Degree Angle Attach Methodology Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design GuidelinesThermal MetrologyThermal MetrologyThermal Metrology Figure 5-1. Zero Degree Angle Attach Heatsink ModificationsFigure 5-2. Zero Degree Angle Attach Methodology Top View Thermocouple Wire6 Reference Thermal Solution 6.1 Operating Environment6.2 Heatsink Performance Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines6.4 Board-Level Components Keepout Dimensions 6.5 Torsional Clip Heatsink Thermal Solution Assembly6.3 Mechanical Design Envelope Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design GuidelinesFigure 6-3. Torsional Clip Heatsink Board Component Keepout Figure 6-4. Retention Mechanism Component Keepout ZonesNOTE All dimensions are in inches NOTE All dimensions are in inchesFigure 6-5. Torsional Clip Heatsink Assembly 6.5.1 Heatsink Orientation6.5.2 Extruded Heatsink Profiles 6.5.3 Mechanical Interface Material6.5.4 Thermal Interface Material 6.5.5 Heatsink Clip6.5.4.1 Effect of Pressure on TIM Performance Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines6.6 Reliability Guidelines 6.5.6 Clip Retention AnchorsFigure 6-7. Torsional Clip Heatsink Extrusion Profile Table 6-2. Reliability GuidelinesA Thermal Solution Component Suppliers A.1 Torsional Clip Heatsink Thermal SolutionIntel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines PartThermal Solution Component Suppliers Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design GuidelinesB Mechanical Drawings Table B-1. Mechanical Drawing ListTorsional Clip Heatsink Assembly Drawing Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design GuidelinesIntel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines Figure B-1. Torsional Clip Heatsink Assembly DrawingMechanical Drawings Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines Figure B-2. Torsional Clip Heatsink DrawingMechanical Drawings Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines Figure B-3.Torsional Clip DrawingMechanical Drawings