Intel 6700PXH manual Packaging Technology, Keepout Exclusion

See Note 1

R

2 Packaging Technology

The Intel® 6700PXH 64-bit PCI Hub component uses a 31 mm x 31 mm, 8-layer FC-BGA package (see Figure 2-1Figure 2-1Figure 2-1, Figure 2-2Figure 2-2Figure 2-2, and Figure 2-3Figure 2-3Figure 2-3).

Figure 2-1. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Top View)

Handling			Die
		0.491 in.	Keepout
Exclusion
			Area
Area	0.291 in.
0.547 in. 0.247 in.		PXH	17.00 mm 21.00 mm	31.00 mm
		Die
0.200 in.
		17.00 mm
		21.00 mm
		31.00 mm

Figure 2-2. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Side View)

Substrate 0.84 ± 0.05 mm

2.445 ± 0.102 mm

2.010 ± 0.099 mm

Decoup

Cap

Die 0.7 mm Max 0.20 See note 4.

0.20

Seating Plane

0.435 ± 0.025 mm

See Note 3

–C–

Notes:

1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach). 2.All dimensions and tolerances conform to ANSI Y14.5M-1994.

3.BGA has a pre-SMT height of 0.5 mm and post-SMT height of 0.41-0.46 mm.

4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped) orientation after reflow.

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines 9