Intel 6700PXH manual Contents

R

Contents

1	Introduction		.....................................................................................................................	7
	1.1	Definition of Terms		7
	1.2	Reference Documents		8
2	Packaging Technology			9
	2.1	Package Mechanical Requirements		10
3	Thermal Specifications			11
	3.1	Thermal Design Power (TDP)		11
	3.2	Die Case Temperature Specifications		11
4	Thermal Simulation			13
5	Thermal Metrology			15
	5.1	Die Case Temperature Measurements		15
		5.1.1 Zero Degree Angle Attach Methodology		15
6	Reference Thermal Solution			17
	6.1	Operating Environment		17
	6.2	Heatsink Performance		17
	6.3	Mechanical Design Envelope		18
	6.4	Board-Level Components Keepout Dimensions		18
	6.5	Torsional Clip Heatsink Thermal Solution Assembly		18
		6.5.1	Heatsink Orientation	20
		6.5.2	Extruded Heatsink Profiles	20
		6.5.3	Mechanical Interface Material	20
		6.5.4	Thermal Interface Material	21
		6.5.5	Heatsink Clip	21
		6.5.6	Clip Retention Anchors	22
	6.6	Reliability Guidelines		22
A	Thermal Solution Component Suppliers			23
	A.1	Torsional Clip Heatsink Thermal Solution		23
B	Mechanical Drawings			25

Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines 3